Method for improving reliability and yield of glue lamination of display substrate group
A substrate assembly and reliability technology, applied in bonding methods, adhesives, nonlinear optics, etc., can solve problems such as substrate warpage, achieve elimination of substrate warpage, improve yield and reliability, and improve hidden dangers and overflow The effect of controlling the risk of glue and glue shortage
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[0039] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.
[0040] control figure 1 , including a first substrate 1 , an adhesive layer 2 and a second substrate 3 .
[0041] control figure 2 , The uneven first substrate 1 is directly bonded to the flat bonding layer 2 of the second substrate 3 , which may generate air gaps.
[0042] control image 3 , the first substrate 1 is concave on the bonding surface (such as image 3 a) Convex (eg image 3 b) Unevenness, the effect after being leveled by the water glue bonding layer 2.
[0043] control Figure 4 , concave (as Figure 4 a) Convex (eg Figure 4 b) The bonding effect of the first substrate 1 after the bonding surface is flattened, and the flat bonding surface of the second substrate.
[0044] control Figure 5 , the first substrate is coated with a flat glue layer 21 by water glue, and the second substrate is coated with water glue layer 22 .
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