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A light-emitting device, manufacturing method thereof, and display panel

A technology for a light-emitting device and a manufacturing method, which can be applied to semiconductor devices, electric solid-state devices, electrical components, etc., can solve the problems of reducing the brightness of light-emitting devices, and achieve the effects of reducing power consumption and improving brightness.

Active Publication Date: 2021-10-22
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of this, the present invention provides a light-emitting device, a manufacturing method thereof, and a display panel, which can solve the problem in the prior art that a certain light-emitting area needs to be sacrificed when designing the electrodes of the light-emitting device, thereby reducing the brightness of the light-emitting device

Method used

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  • A light-emitting device, manufacturing method thereof, and display panel
  • A light-emitting device, manufacturing method thereof, and display panel
  • A light-emitting device, manufacturing method thereof, and display panel

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Embodiment Construction

[0031] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are some, but not all, embodiments of the present invention. Based on the described embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art fall within the protection scope of the present invention.

[0032] Please refer to figure 1 , is a schematic structural diagram of a light-emitting device provided in an embodiment of the present invention. like figure 1 As shown, an embodiment of the present invention provides a light-emitting device, which can make the light generated by the light-emitting device concentrated by shielding most of the surface of the light-emit...

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Abstract

The present invention provides a light-emitting device, a manufacturing method thereof, and a display panel. The light-emitting device includes a semiconductor layer, and the semiconductor layer includes a first semiconductor layer, a light-emitting layer, and a second semiconductor layer stacked; an insulating layer, and the insulating layer includes: a first semiconductor layer. A retaining wall, a second retaining wall and a third retaining wall, the first retaining wall surrounds the outer wall of the semiconductor layer, the second retaining wall at least partially protrudes from the middle area of ​​the surface of the second semiconductor layer, the third retaining wall and The second barrier is spaced apart; the first electrode, the first electrode covers the surfaces of the first barrier and the third barrier that are not in contact with the semiconductor layer and is connected to the first semiconductor layer; the second electrode, the second electrode covers The second barrier is also connected to the second semiconductor layer. According to the light-emitting device of the embodiment of the present invention, most of the semiconductor layer is surrounded by the metal used to make the electrodes, and the metal is used to reflect the light that hits the side and bottom, so that the brightness of the light-emitting device can be effectively improved without increasing the power, thereby reducing Backplane power consumption.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to a light-emitting device, a manufacturing method thereof, and a display panel. Background technique [0002] LED display technology has developed into one of the hot spots of future display technology. Micro LED display technology has independent pixel control, independent lighting control, high brightness, low power consumption, ultra-high resolution and high color. The bonding technology between the Micro LED and the backplane determines the product yield and repair difficulty. The current mainstream technology is to fabricate microtubes at the N-type semiconductor end and the P-type semiconductor end after the light-emitting device is fabricated to bond with the display panel. However, such a design requires sacrificing a certain light-emitting area, thereby reducing the brightness of the light-emitting device. SUMMARY OF THE INVENTION [0003] In view of this, the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/38H01L33/44H01L33/46H01L27/15
CPCH01L33/385H01L33/44H01L33/46H01L27/156H01L2933/0025H01L2933/0016
Inventor 王国英宋振
Owner BOE TECH GRP CO LTD