Circuit board packaging structure and packaging method

A packaging structure and circuit board technology, which is applied in the direction of circuit heating devices, printed circuit components, printed circuits connected with non-printed electrical components, etc., can solve the problem of large deformation stress of printed circuit boards, loose components, Large stress and other problems can be avoided to avoid damage and reduce assembly errors

Active Publication Date: 2020-09-11
富特智电(杭州)信息技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, for some relatively large devices, if they are pre-soldered on the printed circuit board, when the soldered printed circuit board is installed on the heat sink or package, the printed circuit board will bear a large deformation stress, May cause damage to some components on the printed circuit board
At the same time, for some electronic component

Method used

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  • Circuit board packaging structure and packaging method
  • Circuit board packaging structure and packaging method
  • Circuit board packaging structure and packaging method

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[0028] In order to make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be described clearly and completely in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of the embodiments of the present invention, not all the embodiments. The components of the embodiments of the present invention generally described and illustrated in the drawings herein may be arranged and designed in various different configurations.

[0029] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ...

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Abstract

The invention provides a circuit board packaging structure and a packaging method, and belongs to the technical field of circuit board packaging. The circuit board packaging structure comprises a circuit board, a component, a first positioning piece and a radiator shell, wherein the component is installed on the circuit board, the circuit board is installed on the radiator shell, the component islocated in the radiator shell, the first positioning piece is connected in the radiator shell, and the first positioning piece is connected with the component and used for positioning and fixing the component. The invention aims to provide a circuit board packaging structure and a packaging method. According to the circuit board packaging structure, the components can be fixed, so that the components are welded after the components and the radiator shell are fixed, the components are prevented from being damaged by deformation stress of the circuit board when the circuit board is installed onthe radiator shell, and the yield of the circuit board packaging structure is improved.

Description

technical field [0001] The invention relates to the technical field of circuit board packaging, in particular to a circuit board packaging structure and packaging method. Background technique [0002] Most of the printed circuit boards in electronic products are soldered components. The common practice in the industry is that the components are first soldered on the printed circuit board, and then the printed circuit board is installed on the package of electronic products such as radiators. superior. The process of such operation is simple and the cost is low. [0003] However, for some relatively large devices, if they are pre-soldered on the printed circuit board, when the soldered printed circuit board is installed on the heat sink or package, the printed circuit board will bear a large deformation stress, Some components on the printed circuit board may be damaged. At the same time, for some electronic components that need to be attached to the radiator, the process ...

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Application Information

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IPC IPC(8): H05K1/18H05K1/02
CPCH05K1/0212H05K1/18
Inventor 彭维峰
Owner 富特智电(杭州)信息技术有限公司
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