Vacuum adsorption type circular tail end holder

Abstract

The invention discloses a vacuum adsorption type circular tail end holder which comprises a body, a flange which is positioned at one end of the body, and a suction cup which is located at the other end of the body, wherein the suction cup and the flange form an integrated structure through the body, radial grooves are formed in the suction cup, the grooves comprise the first groove which is in aradial annular radial shape and the second groove which is in a radial linear radial shape, and the second groove intersects with the first groove. An existing holder has the problems that the clamping force is not easy to control and a wafer is easy to deform and even break, but by implementing the technical scheme of the invention, air between the suction cup at the tail end of the holder and the wafer is pumped out to form a negative pressure space, and the wafer is stably adsorbed on the suction cup by utilizing atmospheric pressure. The grooves and lines in the suction cup can effectivelyenlarge the contact range of an air chamber and the wafer, improve the stress area and stability of the wafer, reduce the direct contact area with the wafer and meet the requirement for high cleanliness.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a vacuum adsorption type circular end holder. Background technique [0002] In the semiconductor manufacturing process, wafers need to be processed through multiple processes, so wafers need to be transferred between different process units. Since the wafer itself has the characteristics of thin thickness, brittle texture, and high requirements for surface cleanliness, it is necessary to use special methods to ensure that the force on the wafer is appropriate and distributed during the process of being picked up and transferred. Uniform, stable support and no external contamination. At present, the industry mostly adopts the method of mechanical clamping to clamp the wafer from the front and back or the periphery. This method has a simple structure, but it is difficult to control the clamping force, and it is easy to cause deformation or even fragmentation of...

AI Technical Summary

Problems solved by technology

At present, the industry mostly adopts the method of mechanical clamping to clamp the wafer from the front and back or the periphery. This method has a simple structure, but it is not easy to control the clamping force, and it is easy to cause deformation or even fragmentation of the wafer.

[0003] Therefore, the industry urgently needs to provide a new adsorption clamper to solve the problem that it is difficult to control the clamping force and easily cause deformation or even fragmentation of the wafer.

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