Transfer printing plate, preparation method of to-be-cut panel and to-be-cut panel

Abstract

The embodiment of the application provides a transfer printing plate, a preparation method of a to-be-cut panel and a to-be-cut panel. At least two cofferdam structures in a transfer printing plate base plate are respectively enclosed to form at least two transfer printing areas, a plurality of convex part structures are arranged in the cofferdam structures at two opposite side edges of each transfer printing area, and the convex part structures extend towards the transfer printing areas in a direction parallel to the base plate; the convex part structures of one cofferdam structure are in one-to-one correspondence with the convex part structures of the other cofferdam structure; a plurality of corresponding the convex part structures are virtually connected, each transfer printing area isdivided into a plurality of sub-transfer-printing areas, and the sub-transfer-printing areas are used for preparing sub-organic layers, so that the sub-organic layers correspond to sub-display areasof a to-be-cut panel and peripheral areas surrounding the sub-display areas. In this way, the area between the R corners of every two adjacent sub-display areas in the to-be-cut panel is not covered with PI materials, and a technical problem that a GOA unit cannot work normally due to the PI materials is solved in the follow-up process.

Description

technical field [0001] The present application relates to the technical field of display devices, and in particular, to a transfer plate, a method for preparing a panel to be cut, and a panel to be cut. Background technique [0002] In the production process of the thin film transistor liquid crystal display panel, it is necessary to coat the PI (PolyImide, polyimide) alignment layer, and the rotation of the liquid crystal is given a top tilt angle by PI to stabilize the rotation direction of the liquid crystal, thereby making the liquid crystal display panel. Display works normally. At present, the method of coating the PI alignment layer includes dropping the PI material on an APR (Asahikasei Photosensitive Resin, photosensitive resin) plate, and then transferring the PI material to the substrate from the APR plate. [0003] In order to improve the aesthetics of mobile products such as mobile phones and tablet computers, the four top corners of mobile products on the mark...

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Problems solved by technology

[0004] In view of the shortcomings of the existing methods, this application proposes a transfer plate, a preparation method of the panel to be cut and the panel to be cut to solve the problem that the PI material in the prior art will cover the R angle of two adjacent sub-display areas in the panel to be cut In the area between, in the subsequent process, the PI material is easy to absorb water, which leads to the technical problem that the GOA unit cannot work normally

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