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Pump device

A pump device, piezoelectric pump technology, applied in the direction of pump device, pump, piston pump, etc., can solve the problems of high temperature of piezoelectric pump, reduced reliability of pump device, pump failure, etc., to prevent excessively high temperature, The effect of improving reliability

Active Publication Date: 2020-09-29
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the temperature of the pump increases and exceeds the heat-resistant temperature of the pump, the pump may fail, and as a result, the reliability of the pump device may decrease.
[0007] In particular, when piezoelectric pumps are connected in series, the temperature of the downstream piezoelectric pump tends to increase because high-temperature air heated by the upstream piezoelectric pump is supplied to the downstream piezoelectric pump.
Therefore, when the piezoelectric pumps are connected in series, the temperature of the pump on the downstream side rises to exceed the heat-resistant temperature of the pump, and the possibility of failure of the pump is high. As a result, there is a possibility that the reliability of the pump device may decrease.

Method used

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Experimental program
Comparison scheme
Effect test

Embodiment approach

[0029] Hereinafter, embodiments according to the present invention will be described in detail based on the drawings.

[0030]

[0031] figure 1 It is a figure which shows the schematic structure of the pump apparatus 2 of embodiment.

[0032] figure 1 The illustrated pump device 2 includes a first piezoelectric pump 4 , a second piezoelectric pump 6 , a drive unit 8 , a control unit 9 , and a distribution setting unit 10 . The object to be pumped 12 is connected to the second piezoelectric pump 6 .

[0033] The first piezoelectric pump 4 and the second piezoelectric pump 6 are pumps connected in series. The first piezoelectric pump 4 is arranged on the downstream side, and the second piezoelectric pump 6 is arranged on the upstream side. No other pump is provided between the first piezoelectric pump 4 and the second piezoelectric pump 6, and they are directly connected to each other.

[0034] Both the first piezoelectric pump 4 and the second piezoelectric pump 6 of th...

Embodiment 1

[0053] Embodiment 1 is that the inventor uses figure 1 The pump device 2 of the illustrated embodiment was subjected to experiments related to the temperature rise of the piezoelectric pumps 4 and 6 . The experimental conditions and results are as figure 2 as shown.

[0054] figure 2 , the column of "environmental temperature" indicates the temperature (unit: °C) of the surroundings where the pump device 2 is arranged. figure 1 The temperature of the air contained in the shown suction object 12 is substantially the same as the ambient temperature. The column of “input electric power” is the input electric power value (unit: W) supplied from the drive unit 8 to the first piezoelectric pump 4 and the second piezoelectric pump 6 , respectively. The column of "temperature" is the surface temperature of each of the first piezoelectric pump 4 and the second piezoelectric pump 6 after a lapse of a predetermined time (5 minutes in this embodiment). The column "power ratio" is t...

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Abstract

This pump device comprises: a first piezoelectric pump; a second piezoelectric pump which is connected in series to an upstream side of the first piezoelectric pump; a drive part which provides an alternating current power input to the first piezoelectric pump and the second piezoelectric pump; and a distribution setting part which sets a distribution ratio for the input power from the drive partprovided to each of the first piezoelectric pump and the second piezoelectric pump, wherein the distribution setting part sets the ratio of the input power to the second piezoelectric pump with respect to the input power to the first piezoelectric pump to be more than 1 and no more than 1.57.

Description

technical field [0001] The invention relates to pump devices. Background technique [0002] Conventionally, pump devices for transporting fluids such as air have been disclosed (for example, refer to Patent Document 1). [0003] The pump device of Patent Document 1 is a pump device in which a plurality of piezoelectric pumps are connected in series. The pump device drives the piezoelectric pumps by giving a phase difference to the input electric power of adjacent piezoelectric pumps among the plurality of piezoelectric pumps. Thereby, the pressure pulsation in the case where a plurality of piezoelectric pumps are connected in series is alleviated. [0004] The piezoelectric pump used in the pump device of Patent Document 1 has a structure in which a piezoelectric element is bonded to a metal plate, and when AC power is supplied to them, buckling deformation occurs in a single-wafer mode to transport air. [0005] Patent Document 1: Japanese Patent Application Laid-Open No...

Claims

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Application Information

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IPC IPC(8): F04B9/00F04B23/06
CPCF04B23/06F04B17/003F04B49/06F04B2203/0401F04B2203/0402F04B2203/0408F04B23/04
Inventor 田中伸拓
Owner MURATA MFG CO LTD