Copper particle double-sided pre-welding device and welding method

Abstract

The invention relates to a copper particle double-sided pre-welding device and a welding method, and relates to the field of semiconductor packaging manufacturing. The copper particle double-sided pre-welding device comprises a pre-welding mold and a positioning plate, wherein positioning pin columns are arranged on the pre-welding mold, and positioning pin holes are formed in the positioning plate. The welding method comprises the following steps that lower copper particles are put into second accommodating cavities; then lower welding sheets, middle copper particles and upper welding sheetsare sequentially put into corresponding first accommodating cavities; the positioning plate and the pre-welding mold are connected through the positioning pin holes and the positioning pin columns, and then square positioning protruding blocks are connected with square positioning grooves in an abutted manner; the upper copper particles are placed into cylindrical sections through inverted circular truncated cone sections, and then the bottom of each upper copper particle is in contact with the corresponding upper welding sheet; and finally the whole formed by pre-welding mold and the positioning plate is integrally placed in a welding furnace for welding. According to the copper particle double-sided pre-welding device and the welding method, the problem that the copper particles, the upper welding sheets, the middle copper particles, the lower welding sheets and the lower copper particles are not on the same vertical straight line when the welding is completed can be solved, and theproblem that purchased convex copper particles cannot be applied to some chips due to the fact that the convex copper particles are high in prices and single in specification can be solved.

Description

technical field [0001] The invention relates to the field of semiconductor package manufacturing, in particular to a double-sided pre-welding device and welding method for copper particles. Background technique [0002] When stacking chips, in order to protect the glass passivation chip from being damaged, a layer of cylindrical medium copper particles 33 with the same size as the chip needs to be added between the chips. The sheet 32 ​​and the lower soldering sheet 33 are welded with a cylindrical upper copper particle 31 and a cylindrical lower copper particle 35 with a smaller diameter, so as to ensure that they are not short-circuited by the middle copper particle and solder. Among them, the upper copper particle, the upper solder piece, the middle copper particle, the lower solder piece and the lower copper particle are all cylindrical structures, the diameters of the upper solder piece, the middle copper particle and the lower solder piece are equal, and the diameters ...

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a copper particle double-sided pre-welding device and welding method to solve the problem that when the welding is completed, the upper copper particle, the upper solder piece, the middle copper particle, the lower solder piece and the lower copper particle are not in the same vertical direction. The problem that online and purchased copper bumps are expensive and have a single specification so that they cannot be used on some chips

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