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Wafer grinding method and wafer grinding system

A wafer and grinding technology, applied in the direction of grinding workpiece support, grinding drive device, grinding machine tool parts, etc., can solve the problems of low precision, poor consistency of surface shape compensation, and many iterations, so as to improve efficiency and precision, the effect of improving precision

Active Publication Date: 2020-10-02
TSINGHUA UNIV +1
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  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, the existing technology mainly relies on the grinding experience of the equipment operator to determine the spindle pose of the grinding equipment after wafer grinding, lacks systematic identification and quantitative analysis methods for surface features, and lacks a method for Automatic and precise decision-making for spindle pose adjustment
The existing method relying on the operating experience of the equipment operator has problems such as poor consistency of surface shape compensation, many iterations, slow speed, and low precision, which limits the improvement of the precision, automation, and intelligence of the grinding equipment.

Method used

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  • Wafer grinding method and wafer grinding system
  • Wafer grinding method and wafer grinding system
  • Wafer grinding method and wafer grinding system

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Embodiment Construction

[0028] The application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the related inventions, rather than to limit the inventions. It should also be noted that, for ease of description, only parts related to the invention are shown in the drawings. It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other.

[0029] In addition, it should also be noted that the terms such as front, back, up, down, left, right, top, bottom, front, back, horizontal, vertical, etc. used in this application to indicate orientation are only for convenience of description and are used to to aid in the understanding of relative positions or orientations, and is not intended to limit the orientation of any device or structure.

[0030] The prese...

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Abstract

The invention relates to a wafer grinding method which comprises the following steps of detecting surface shape features: selecting multiple measurement points on a wafer surface to be ground, and measuring the thickness of a wafer at each measurement point; identifying the surface shape features: acquiring the plumpness of the surface to be ground on the basis of each thickness measured in the step of detecting the surface shape features; and adjusting a pose and grinding: adjusting a relative space position relationship between a wafer working table for loading the wafer and a grinding toolfor grinding on the basis of the plumpness obtained in the step of identifying the surface shape features, and carrying out compensatory grinding operation on the surface to be ground through a grinding tool. The invention further relates to a grinding system constructed for implementing the wafer grinding method. The wafer grinding method and the wafer grinding system provided by the invention have the advantages that the wafer grinding efficiency and accuracy can be improved.

Description

technical field [0001] The present application relates to a wafer grinding method and a wafer grinding system, in particular to a method and system for performing compensatory grinding operations on the surface of a wafer based on surface feature detection and recognition. Background technique [0002] Wafer grinding generally relies on in-situ detection and compensation technology to achieve ultra-flat surface shape. After the wafer is ground, the thickness distribution of the wafer is obtained by relying on a non-contact measuring device, and then the spindle pose of the grinding equipment is adjusted to improve the uniformity of the thickness through compensation processing. [0003] However, the existing technology mainly relies on the grinding experience of the equipment operator to determine the spindle pose of the grinding equipment after wafer grinding, lacks systematic identification and quantitative analysis methods for surface features, and lacks a method for Aut...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B7/06B24B7/22B24B27/00B24B41/06B24B47/12B24B47/22B24B49/00B24B51/00
CPCB24B7/06B24B7/228B24B27/0023B24B27/0069B24B27/0076B24B41/061B24B41/068B24B47/12B24B47/22B24B49/00B24B51/00
Inventor 刘远航赵德文李长坤马旭路新春
Owner TSINGHUA UNIV