Heat dissipation device for computer based on Internet of Things

Abstract

The invention discloses a heat dissipation device for a computer based on Internet of Things. The heat dissipation device comprises a case, a mainboard is installed in the case, a processor is installed on the mainboard, and a radiating copper plate is arranged above the processor; an S-shaped channel is formed in the heat dissipation copper plate; an inlet and an outlet of the S-shaped channel are respectively positioned at the left and right ends of the heat dissipation copper plate; a water tank is arranged on one side of the top in the case; the inlet and the outlet of the S-shaped channelare respectively connected with the water tank through a first C-shaped pipe and a second C-shaped pipe; and a box body with a downward opening is arranged at the top of the heat dissipation copper plate, a first through hole is formed in the middle of the top face of the box body, a vertical shaft is installed in the first through hole through a sealing bearing, multiple fan blades are installedat the periphery of the lower end of the vertical shaft, and two second through holes are symmetrically formed in the two sides of the first through hole in the top face of the box body. According tothe device, ingenious combination of multiple heat dissipation modes such as water cooling, air cooling and evaporation heat absorption is achieved, the heat dissipation effect of a computer is greatly improved, the device has the heat dissipation capacity which a traditional heat dissipation mode does not have, other functions such as a humidifier are achieved, and the use environment of the computer can be improved.

Description

technical field [0001] The invention belongs to the technical field of computer cooling, in particular to a cooling device for a computer based on the Internet of Things. Background technique [0002] The CPU (that is, the processor) and other components of a computer will generate heat during high-speed operation, and if the heat is allowed to accumulate, it is likely that the CPU and other components will eventually be burned out. Therefore, when designing a computer, it is necessary to Adding a heat dissipation system or heat dissipation structure, heat dissipation is actually a process of heat transfer, the purpose is to bring the heat generated by computer heating components, especially the CPU, to other media, and control the CPU temperature within a stable range. Most of the existing heat dissipation It is air-cooled and water-cooled. With the rapid development of computer processors, a good heat dissipation system can help it maximize its processing capacity. The exi...

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Problems solved by technology

[0002] The CPU (that is, the processor) and other components of a computer will generate heat during high-speed operation, and if the heat is allowed to accumulate, it is likely that the CPU and other components will eventually be burned out. Therefore, when designing a computer, it is necessary Adding a heat dissipation system or heat dissipation structure, heat dissipation is actually a process of heat transfer, the purpose is to bring the heat generated by computer heating components, especially the CPU, to other media, and control the CPU temperature within a stable range. Most of the existing heat dissipation It is air-cooled and water-cooled. With the rapid development of computer processors, a good heat dissipation system can help it maximize its processing capacity. The existing heat dissipation technology has limited heat dissipation effect. Now it is necessary to design a heat dissipation device with better effect

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