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Laminate and method for manufacturing laminate

A technology of laminates and coatings, applied in chemical instruments and methods, semiconductor/solid-state device manufacturing, coatings, etc., can solve problems such as unresearched, substrate warpage, etc., and achieve high dimensional accuracy.

Active Publication Date: 2020-10-02
AGC INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in the manufacturing process of WLP, such as figure 1 As shown, there are processes under high temperature conditions such as the release layer lamination process and the resin mold production process, and the substrate may warp due to heat.
[0004] As the improvement of the warp, studies have been made to improve it by using a support glass substrate with less warp, but the purpose is to cancel the WLP by warping the support glass substrate in the direction opposite to the warp that occurred in advance in the WLP manufacturing process. Studies for the purpose of warpage occurring during the manufacturing process have not been conducted
[0005] In addition, it is known that warping is caused by coating a thin film on a glass substrate (Patent Document 2), but a technique for efficiently warping a glass plate with a thinner film has not been studied.

Method used

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  • Laminate and method for manufacturing laminate
  • Laminate and method for manufacturing laminate
  • Laminate and method for manufacturing laminate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0066] Utilize the float method to obtain composition 1 (in terms of mass % SiO 2 : 56.9%, Al 2 o 3 : 8.1%, CaO: 2.3%, SrO: 12.3%, BaO: 20.4%) glass raw material plate (length and width 1000mm, thickness 1.4mm). A circular shape with a radius of 75 mm (diameter: 150 mm) was cut out from the center of the raw material sheet to prepare a disc-shaped glass plate. After chamfering, grinding was performed with a double-side grinder (16B-N / F manufactured by Hamai Seisakusho Co., Ltd.), and the plate thickness (dg) was adjusted to 1.0 mm. The radius of curvature r0 (based on the float method) of the glass sheet was 370 m under self-weight deflection correction.

[0067] Thereafter, a silicon nitride film was formed by reactive sputtering using a silicon target using a sputtering apparatus (SIV-345XYSSS manufactured by ULVAC) on the warped convex side of the glass plate so that the compressive stress of the film became 1 GPa. The thickness (dc) of the coating was 0.5 μm. Table 1 ...

Embodiment 2～ Embodiment 7 and comparative example 1～4

[0069] Except having changed into the conditions described in Table 1, it carried out similarly to Example 1. Table 1 shows the evaluation results.

[0070]

[0071] (quality%)

[0072] Composition 1: SiO 2 : 56.9%, Al 2 o 3 : 8.1%, CaO: 2.3%, SrO: 12.3%, BaO: 20.4%

[0073] Composition 2: SiO 2 : 68.9%, Al 2 o 3 : 5.9%, MgO: 4.1%, CaO: 7.3%, Na 2 O: 14.6%, K 2 O: 0.2%

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Abstract

The present invention provides a laminate having a glass plate and a coating layer, wherein: the coating layer contains one or more components selected from the group consisting of silicon nitride, titanium oxide, alumina, niobium oxide, zirconia, indium-tin oxide, silicon oxide, magnesium fluoride, and calcium fluoride; the ratio (dc / dg) of the thickness dg of the glass plate and the thickness dcof the coating layer is in the range of 0.05*10<-3> to 1.2*10<-3>; and the radius of curvature r1 of the laminate in a self-weight gravity deflection correction condition is 10-150 m. (FR)

Description

technical field [0001] The present invention relates to a laminate and a method for manufacturing the laminate, and more specifically, to a supporting glass substrate for supporting a substrate to be processed in a semiconductor package manufacturing process. Background technique [0002] In wafer-level packaging (WLP), a fan-out type (fan-out type) WLP has been proposed. In fan-out type WLP, it is known to use a glass substrate for supporting the processed substrate in order to suppress the dimensional change of the processed substrate (Patent Document 1). [0003] However, in the manufacturing process of WLP, such as figure 1 As shown, there are processes under high temperature conditions such as the release layer lamination process and the resin mold production process, and the substrate may warp due to heat. [0004] As the improvement of the warp, studies have been made to improve it by using a support glass substrate with less warp, but the purpose is to cancel the W...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03C17/22B32B9/00B32B17/06C03C3/083C03C3/085C03C3/087C03C3/091
CPCC23C14/34C23C14/10C23C14/086C23C14/083C23C14/0694C23C14/0652C03C17/22C03C3/091C03C17/23C03C3/087C03C2217/23C03C2217/29C03C2218/154B32B9/00B32B17/06C03C17/225C03C17/09C03C17/2456C03C2218/155C03C2217/212C03C2217/281H01L21/561H01L21/568H01L2224/96C23C14/0036C23C14/3407H01L21/566
Inventor 山本浩史赤尾安彦藤原晃男今城信彦
Owner AGC INC