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Detection device and manufacturing method thereof

A detection device and manufacturing method technology, which is applied in the direction of measuring devices, measuring device shells, measuring electrical variables, etc., can solve the problems of short circuit in the metal hole of the probe and poor test quality, so as to avoid short circuit, improve test quality, and increase production capacity Effect

Active Publication Date: 2020-10-09
SILICONWARE PRECISION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, it is known that the probes of the detection device are installed in the metal holes, so under the design of the tightly arranged holes, the probes and the metal holes are easy to touch and a short circuit occurs, resulting in poor test quality

Method used

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  • Detection device and manufacturing method thereof
  • Detection device and manufacturing method thereof
  • Detection device and manufacturing method thereof

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Embodiment Construction

[0043] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0044] It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the present invention. Limiting conditions, so there is no technical substantive meaning, any modification of structure, change of proportional relationship or adjustment of size, without affecting the effect and purpose of the present invention, should still fall within the scope of the present invention. The disclosed technical content must be within the scope covered. At the same time, terms such as "first", "second", "upper", "lo...

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Abstract

A detection device includes: a metal body having a plurality of main vias, a plurality of main through holes with insulators formed on the hole walls of the main vias, and a plurality of connecting elements disposed in the main through holes. Therefore, when testing a chip with I / O pins of high density with the detection device, the connecting elements contact the insulator only, without contacting the hole walls of the main vias, and the problem of short circuits can be avoided. A method of forming a detection device is also provided.

Description

technical field [0001] The present invention relates to a detection device, in particular to a detection device with probe pins and a manufacturing method thereof. Background technique [0002] Due to factors such as the pin position design of the traditional detection device with a probe card structure, it is not suitable for circuit measurement with high bandwidth characteristics, and due to the size limit of the probe card itself, it is not suitable for some relatively small circuits. In other words, the packaged probe card structure is not suitable for measuring circuits with relatively small dimensions. [0003] In addition, since the functionality of various electronic products is continuously improved, and the volume is required to be miniaturized, the density of the number of I / O pins of a single chip is denser. [0004] However, it is known that the probes of the detection device are installed in the metal holes, so under the design of the closely arranged holes, t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R1/04
CPCG01R1/0433G01R1/0416G01R1/07371G01R1/06744G01R1/0483G01R1/07342
Inventor 江国栋李振堃郭谨榕
Owner SILICONWARE PRECISION IND CO LTD
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