Hybrid Electromagnetic Coupling Compact SIW Filter Based on Evanescent Mode Loading
A hybrid electromagnetic and compact technology, applied in the direction of waveguide devices, circuits, electrical components, etc., can solve the problems of high sideband suppression, small size, small in-band loss, etc., and achieve high quality factor, high selectivity, and reduced The effect of small relative size
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Embodiment 1
[0034] The hybrid electromagnetic coupling compact SIW filter based on evanescent mode loading can well solve the problem that the traditional filter technology design compact and highly selective bandpass filter can no longer fully meet the needs of technological development, and has in-band loss. Small, high sideband suppression and small-sized features such as figure 1 , 2, 3, and 4, the following arrangement method is adopted in particular: a three-layer substrate-integrated waveguide cavity 1 is stacked, and a metal post 2 is arranged at the center of each layer of the substrate-integrated waveguide cavity. Metal layers are stacked on the upper and lower sides of the substrate integrated waveguide cavity (the metal layer 3 between the uppermost cavity and the middle cavity, the metal layer 4 between the middle cavity and the lowermost cavity, the metal layer 4 between the uppermost cavity and the lowermost cavity) The upper metal layer 5, the lowermost metal layer 6), th...
Embodiment 2
[0036] This embodiment is further optimized on the basis of the foregoing embodiments, and the same parts as the foregoing technical solutions will not be repeated here, such as figure 1 , 2 , 3, and 4, further in order to better realize the present invention, the following setting method is adopted in particular: the height of the metal pillar 2 on each layer is slightly less than (almost equal to) the height of the integrated waveguide cavity of the substrate of this layer Thickness; preferably, the single-layer substrate-integrated waveguide cavity has a width of 6 mm, a length of 7.3 mm, and a thickness of 0.4 mm, and the metal pillar has a diameter of 0.4 mm and a height of 0.36 mm.
Embodiment 3
[0038] This embodiment is further optimized on the basis of any of the above-mentioned embodiments, and the same parts as the aforementioned technical solutions will not be repeated here, such as figure 1 , 2 , 3, and 4, further in order to better realize the present invention, the following setting method is adopted in particular: the substrate-integrated waveguide cavity is surrounded by edge metal columns vertically arranged on the edge of the substrate where the substrate-integrated waveguide cavity is located combined.
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