A circuit board solder paste printing tooling
A solder paste printing and circuit board technology, applied in the field of circuit board solder paste printing tooling, can solve problems such as affecting the soldering quality of components on the circuit board, unable to ensure accurate coverage of the solder paste, affecting work efficiency, etc., to improve quality and work efficiency. Efficiency, accurate alignment, and ensure the effect of accurate alignment
Active Publication Date: 2021-12-10
BEIJING INST OF RADIO METROLOGY & MEASUREMENT
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- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Because this solder paste printing method visually aligns the mesh and the pad, there is a visual error, and because there is a possibility of pushing the screen to be misaligned during the subsequent movement of the squeegee, it cannot guarantee that the solder paste will accurately cover the corresponding pad. , affecting the final soldering quality of components on the circuit board
And it takes a long time for visual alignment, which affects work efficiency
Method used
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Embodiment Construction
[0041] The present invention will be more clearly described below, and the preferred embodiments and the drawings are further illustrated. The similar components in the drawings are shown in the same reference numerals. Those skilled in the art will appreciate that the following description is illustrative and not limiting, and the scope of the invention should not be limited.
[0042] For the prior art process of solder paste printed circuit board and a low bit inaccurate printing efficiency, such as figure 1 , One embodiment of the present invention discloses A circuit board positioning tooling, the tooling comprising:
[0043] Base 1, a first surface of the base 1 defines a groove for limiting mounting circuit board 11;
[0044] Base 1, a first surface of the base 2 is provided with at least two positioning pins and a circuit board receiving grooves 11 of the stopper;
[0045] Ejection member 4, provided to the base 1 and for ejecting the circuit board from within the limiting ...
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The invention discloses a circuit board solder paste printing tool, comprising: a base, the first surface of the base is provided with at least two positioning pins and a limit groove for accommodating the circuit board; an ejection part is arranged on the The base is also used to eject the circuit board from the limiting groove; the printed screen is provided with mesh holes corresponding to the pads on the circuit board, and is attached to the printed circuit board through the positioning pins. first surface. The printing tooling of the present invention can quickly and accurately fix the circuit board, and then realize the accurate positioning of the printing screen through the positioning pins, effectively ensure the accurate alignment of the circuit board and the printing screen, and ensure that no solder paste occurs during the printing process. dislocation. The printing tooling of the present invention can also quickly take out the printed circuit board with solder paste. The printing tooling of the invention makes the whole solder paste printing process accurate in position, easy to operate, and improves the quality and work efficiency of electronic component solder paste printing.
Description
Technical field [0001] The present invention relates to the field of circuit board mounting. More particularly, to a printed wiring board solder paste tooling. Background technique [0002] Paste solder printed wiring board is good or bad based. However, since the number of electronic components once produced, electronic components and solder paste printing equipment is generally not used, so the current printing is used more easy way. The main steps are: first, the wiring board placed on the operating table, and then a mesh shape and size as the pads on the circuit board corresponding to the position of the steel sheet placed on the circuit board, and the pad was visually align mesh , a hand operator then hold the stencil, solder paste sticking the other hand to the screen to move the blade back and forth. Paste through a mesh screen plate covering the circuit board pads, solder paste printing is completed. This is because the solder paste printing method and the pad was visuall...
Claims
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IPC IPC(8): H05K3/34
CPCH05K3/34
Inventor 哈斯图亚郑文强段友峰崔巍
Owner BEIJING INST OF RADIO METROLOGY & MEASUREMENT