Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

LED light source packaging structure for electronic information engineering

A technology of LED light source and electronic information, applied in the field of light source lighting, can solve problems such as inconvenient observation, instability, chip damage, etc.

Active Publication Date: 2020-10-20
JIAN COLLEGE
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, LED light sources have been applied everywhere in life, and have many advantages such as small size, low power consumption, long service life, environmental protection, and durability. There are double shadows in the emitted light, which makes observation inconvenient. Moreover, the direction of the light is fixed, and the direction of the light cannot be adjusted freely. When observing some irregular and small objects, it is necessary to concentrate and further diffuse the scattered light. The light irradiates the surface of the object. Most of the current light source packaging structures cannot adjust the light inside the light, and need to use external tools for observation, which occupies the hands of the experimenter and increases the tediousness and inconvenience of the experimental process. Among them, the LED The chip in the structure is also susceptible to a large amount of unstable heat generated by the metal conductor in the circuit layer, which is transferred to the surface chip, causing damage to the chip;

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • LED light source packaging structure for electronic information engineering
  • LED light source packaging structure for electronic information engineering
  • LED light source packaging structure for electronic information engineering

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] refer to figure 1 , the present invention provides a technical solution: an LED light source packaging structure for electronic information engineering, which includes a fixing assembly 2, a twisting assembly 3, and a light source packaging device 1, and the center of the right side of the fixing assembly 2 is fixedly connected to the connecting cylinder 4 , the right end of the connecting cylinder 4 is connected through the axis of the torsion assembly 3, the right side of the torsion assembly 3 is rotatably connected to the light source packaging device 1, and is fixedly connected to the housing 8 through the fixing assembly 2, and through the connection cylinder 4 The internal conductive electric energy enters the twisting component 3 and the light source packaging device 1, the direction of the light source packaging device 1 is adjusted by the twisting component 3, and then the intensity, scattering and concentration of the light beam are intelligently adjusted thro...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an LED light source packaging structure for electronic information engineering. The LED light source packaging structure comprises a fixing assembly, a torsion assembly and a light source packaging device; the center of the right side of the fixing assembly is fixedly connected with a connecting cylinder, and the right end of the connecting cylinder is connected with the axis of the torsion assembly in a penetrating mode; and the right side of the torsion assembly is rotationally connected with the light source packaging device. The fixing assembly is fixedly connectedwith a shell, electric energy is transmitted into the torsion assembly and the light source packaging device through the interior of the connecting cylinder, and the direction of the light source packaging device is adjusted through the torsion assembly; and the light source packaging device is used for intelligently adjusting the intensity, scattering and gathering of the light beam so as to meetthe requirement of a required light source.

Description

technical field [0001] The invention relates to the technical field of light source lighting, in particular to an LED light source package structure for electronic information engineering. Background technique [0002] At present, LED light sources have been applied everywhere in life, and have many advantages such as small size, low power consumption, long service life, environmental protection, and durability. There are double shadows in the emitted light, which makes observation inconvenient. Moreover, the direction of the light is fixed, and the direction of the light cannot be adjusted freely. When observing some irregular and small objects, it is necessary to concentrate and further diffuse the scattered light. The light irradiates the surface of the object. Most of the current light source packaging structures cannot adjust the light inside the light, and need to use external tools for observation, which occupies the hands of the experimenter and increases the tedious...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): F21V19/00F21V14/02F21V5/04F21V29/15F21Y115/10
CPCF21V19/0025F21V19/0035F21V14/02F21V5/048F21V29/15F21Y2115/10
Inventor 刘仕琴舒慧欣李靓琦彭胜喜戴琴
Owner JIAN COLLEGE
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products