Circuit board and protective film pasting device and pasting method

Abstract

The invention relates to the field of circuit boards. The circuit board and protective film pasting device comprises a film feeding mechanism, a film pulling mechanism and an upper jacking mechanism.The film feeding mechanism, the film pulling mechanism and the upper jacking mechanism are all fixed to a workbench. A discharging opening of the film feeding mechanism is connected with the film pulling mechanism. The film pulling mechanism is located above the upper jacking mechanism and is connected with the upper jacking mechanism. According to the device, the relative position between a circuit board and a protective film is guaranteed to be accurate during pasting by arranging the film feeding mechanism; and by arranging the film pulling mechanism and the upper jacking mechanism, the pasting time of the protective film is shortened.

Description

technical field [0001] The invention relates to the field of circuit substrates, in particular to a circuit substrate protective film mounting device and mounting method. Background technique [0002] Circuit substrate products are composed of circuit substrate, positioning jig and protective film: the positioning jig is fixed on both sides of the circuit substrate and connected with the circuit substrate; the protective film is attached to the surface of the circuit substrate and does not contact the positioning jig. The following steps are mainly included in the process of circuit substrate film sticking: 1) Put the circuit substrate and the positioning fixture connected to it into the storage mechanism, and the storage mechanism will move it and control the output of the circuit substrate; 2) The storage mechanism Push the circuit substrate to the blanking mechanism, and the blanking mechanism quickly blanks the circuit substrate; 3) The circuit substrate is blanked to th...

AI Technical Summary

Problems solved by technology

[0003] The prior art has the following deficiencies: 1. When feeding the protective film, after the cut-off module cuts off the protective film, there is a certain distance between the protruding end of the protective film and the pressing end of the protective film. This section of the protective film is a free section for the next The station mechanism grabs the protective film; and because the material of the protective film is soft, the protruding end of the protective film will be warped and deformed by the air circulation in the space, making the protruding end of the protective film relative to the next station. The position of the mechanism changes, which affects the accuracy of the protective film placement

2. When attaching the protective film to the circuit substrate, the movement of the circuit substrate drives the protective film wound on the winding drum to move accordingly to attach the protective film to the circuit substrate; and the circuit substrate is large in size, in order to ensure that the circuit The substrate moves smoothly, and the circuit substrate can only move at a lower speed when moving, which makes the process of mounting the protective film longer and increases the mounting time of the protective film

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