Interpolation matrix construction method and device of integrated circuit electromagnetic simulation multi-grid method

Abstract

The invention discloses an interpolation matrix construction method and device of an integrated circuit electromagnetic simulation multi-grid method. The interpolation matrix construction method comprises the steps that: posterior error estimation is conducted on an electromagnetic field, calculated based on coarse grids, of a multi-scale structure layout in multi-layer super-large-scale integrated circuit electromagnetic simulation, new nodes are interpolated into an integrated circuit coarse grid area with errors exceeding a set value, so that fine grids are obtained, and therefore, self-adaptive finite element subdivision grids are formed; the new nodes are divided into boundary new nodes and internal new nodes, and interpolation relationships of the boundary new nodes and the internalnew nodes of the fine grids, and to-be-solved field quantities of the coarse grid nodes; and the interpolation relationship corresponding to the boundary new nodes and the interpolation relationship corresponding to the internal new nodes are combined into an interpolation relationship between the coarse grids and the fine grids, and an overall interpolation matrix between the coarse grids and thefine grids applied to the multi-grid method is obtained. According to the interpolation matrix construction method and device of the invention, the convergence rate of large-scale sparse matrix iterative solution in multi-layer super-large-scale integrated circuit electromagnetic simulation can be greatly improved, and then the solution efficiency is improved.

Description

technical field [0001] The invention relates to the field of electromagnetic simulation of integrated circuits, in particular to an interpolation matrix construction method and device of a multi-grid method for electromagnetic simulation of integrated circuits. Background technique [0002] Integrated circuits have played a very important role in all walks of life and are the cornerstone of the modern information society. It is a miniature electronic device or component. It uses a certain process to interconnect the transistors, resistors, capacitors, inductors and other components and wiring required in a circuit, and makes them on a small or several small semiconductor chips or media. on the substrate, and then encapsulated in a package to become a microstructure with the required circuit functions. [0003] The electromagnetic field problem of integrated circuits can be described by partial differential equations plus boundary conditions, but due to the complexity of the...

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Problems solved by technology

[0004] However, the inventor found in the process of implementing the present invention that in the existing method for solving the large-scale sparse matrix of multi-layer VLSI electromagnetic simulation, the calculation results before grid s

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