Interpolation matrix construction method and device for integrated circuit electromagnetic simulation multigrid method

Abstract

This application discloses an interpolation matrix construction method and device of the multi-grid method for electromagnetic simulation of integrated circuits. The method includes performing a posteriori error estimation on the electromagnetic field calculated based on the coarse grid for the multi-scale structural layout in multi-layer VLSI electromagnetic simulation. , and insert new nodes into the coarse grid area of ​​the integrated circuit where the error exceeds the set value to obtain a fine grid, forming an adaptive finite element subdivision grid; divide the new node into a boundary new node and an internal new node, and respectively establish a fine grid The interpolation relationship between the boundary new node, the internal new node and the coarse grid node to be solved; the interpolation relationship corresponding to the boundary new node and the internal new node are merged into the interpolation relationship between the coarse-fine grid , to obtain the overall interpolation matrix between coarse and fine grids applied to the multigrid method. The application can greatly improve the convergence speed of large-scale sparse matrix iterative solution in multi-layer VLSI electromagnetic simulation, thereby improving the solution efficiency.

Description

technical field [0001] The invention relates to the field of electromagnetic simulation of integrated circuits, in particular to an interpolation matrix construction method and device of a multi-grid method for electromagnetic simulation of integrated circuits. Background technique [0002] Integrated circuits have played a very important role in all walks of life and are the cornerstone of the modern information society. It is a miniature electronic device or component. It uses a certain process to interconnect the transistors, resistors, capacitors, inductors and other components and wiring required in a circuit, and makes them on a small or several small semiconductor chips or media. on the substrate, and then encapsulated in a package to become a microstructure with the required circuit functions. [0003] The electromagnetic field problem of integrated circuits can be described by partial differential equations plus boundary conditions, but due to the complexity of the...

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Problems solved by technology

[0004] However, the inventor found in the process of implementing the present invention that in the existing method for solving the large-scale sparse matrix of multi-layer VLSI electromagnetic simulation, the calculation results before grid subdivision and the grid before and after subdivision are not used On the one hand, it leads to slow convergence speed and low solution efficiency of large-scale sparse matrix iterative solution in electromagnetic simulation of multi-layer VLSI

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