High-power cold air blowing heat dissipation auxiliary mechanism for computer mainboard
A technology for computer motherboards and auxiliary mechanisms, which is applied in computing, instruments, electrical digital data processing, etc., and can solve problems such as computer performance degradation
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0023] see Figure 1-4 , a high-power cold air blowing and heat dissipation auxiliary mechanism for computer motherboards, comprising a frame 1, the frame 1 is cylindrical, the bottom is provided with fixed threaded holes, the top is provided with uniformly distributed heat dissipation holes, and the outer side is provided with brackets 2 suitable for air-conditioning manufacturing. with threaded holes. The inside of the frame 1 is fixedly connected with an a...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com