High-power cold air blowing heat dissipation auxiliary mechanism for computer mainboard

A technology for computer motherboards and auxiliary mechanisms, which is applied in computing, instruments, electrical digital data processing, etc., and can solve problems such as computer performance degradation

Inactive Publication Date: 2020-10-27
广州圣希悦贸易有限公司
View PDF0 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the deficiencies of the prior art, the present invention provides a high-power air-conditioning blowing and heat-dissipating auxiliary mechanism for computer motherboards, which h...

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High-power cold air blowing heat dissipation auxiliary mechanism for computer mainboard
  • High-power cold air blowing heat dissipation auxiliary mechanism for computer mainboard
  • High-power cold air blowing heat dissipation auxiliary mechanism for computer mainboard

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0023] see Figure 1-4 , a high-power cold air blowing and heat dissipation auxiliary mechanism for computer motherboards, comprising a frame 1, the frame 1 is cylindrical, the bottom is provided with fixed threaded holes, the top is provided with uniformly distributed heat dissipation holes, and the outer side is provided with brackets 2 suitable for air-conditioning manufacturing. with threaded holes. The inside of the frame 1 is fixedly connected with an a...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to the technical field of computer auxiliary equipment, and discloses a high-power cold air blowing heat dissipation auxiliary mechanism for a computer mainboard. The high-powercold air blowing heat dissipation auxiliary mechanism comprises a rack. A cold air manufacturing support is fixedly connected to the interior of the rack, and an electric motor is fixedly connected tothe top of the cold air manufacturing support. The invention discloses a high-power cold air blowing heat dissipation auxiliary mechanism for a computer mainboard. The electric motor drives the rotating main shaft to rotate; the rotating spindle drives the electromagnet to rotate; a magnetic refrigeration block, an air exchange pipe, a heat dissipation pipe, a heat absorption pipe, a hot air exchange valve, a cold air exchange valve and other mechanisms are matched for use. Therefore, an automatic refrigeration effect is achieved; the electric motor drives the rotating main shaft to rotate, the rotating main shaft drives the rotating crank to rotate, the rotating crank drives the compression plate to rotate, the compression plate drives the driven fan wheel to rotate through compressed cold air, the driven fan wheel drives the air blowing fan blades to rotate, and then through cooperative use of a fan rotating shaft and other mechanisms, the quick cooling effect is achieved.

Description

technical field [0001] The invention relates to the technical field of computer auxiliary equipment, in particular to a high-power cold air blowing and heat dissipation auxiliary mechanism for a computer motherboard. Background technique [0002] When the computer is running large-scale games or software, it often causes the computer to be overloaded, causing the motherboard to heat up, resulting in a decrease in computer performance. In severe cases, the motherboard may be burned and cause harm to users. It is not very good, so people have proposed various methods, among which the most popular in the market is water cooling, but water cooling has high safety, the cooling speed is not very effective in long-term operation, and the installation of water cooling is also very difficult. Contents of the invention [0003] (1) Solved technical problems [0004] Aiming at the deficiencies of the prior art, the present invention provides a high-power air-conditioning blowing and...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): G06F1/20
CPCG06F1/20
Inventor 何伯韬
Owner 广州圣希悦贸易有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap