Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Silicon wafer cutting device

A technology for cutting devices and silicon wafers, which is applied to fine working devices, machine tools suitable for grinding workpiece planes, grinding machines, etc., and can solve problems such as inability to grind silicon wafers, affecting the working environment, and flying debris. Achieve good absorption and filtration, improve environmental quality, and facilitate cutting

Inactive Publication Date: 2020-11-03
肖小勇
View PDF0 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing silicon wafer cutting device has a single function, and cannot polish the silicon wafer well after cutting, and debris is prone to flying randomly during the cutting process, which affects the working environment

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Silicon wafer cutting device
  • Silicon wafer cutting device
  • Silicon wafer cutting device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0023] The present invention provides such Figure 1-5 A cutting device for a silicon wafer is shown, comprising a mounting base 1, a mounting plate 2, a support column 3, a fixing plate 4, a top seat 11, a cutting structure 13 and a grinding structure 14, and a slide is provided at the top of the mounting base 1. cavity, the sliding cavity is slidably provided with a mounting plate 2;

[0024] The top center of the mounting plate 2 is fixed with a top seat 1...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a silicon wafer cutting device which comprises a mounting base, a mounting plate, a supporting column, a fixing plate, a top base, a cutting structure and a grinding structure,a sliding cavity is formed in the top of the mounting base, and the mounting plate is arranged on the sliding cavity in a sliding manner. The top base is fixed to the center of the top of the mounting plate, a fixed base is rotatably arranged at the top of the top base, an adjusting rod is rotatably arranged at the center of a rotating cylinder, a rotating ring is fixed to the top of the adjusting rod, and a pressing plate is fixed to the bottom of the adjusting rod; and the cutting structure is mounted at one side edge of the top of the mounting base, the grinding structure is mounted in a grinding cavity, and a dust suction structure is arranged in the mounting base. The silicon wafer cutting device is reasonable in design, silicon wafers with different diameters can be cut according toneeds, meanwhile, the silicon wafers can be well polished after being cut, meanwhile, cut chippings can be well absorbed and filtered, and the silicon wafer cutting device is suitable for applicationand popularization.

Description

technical field [0001] The invention belongs to the technical field of silicon wafer processing, and in particular relates to a silicon wafer cutting device. Background technique [0002] Solar energy is an inexhaustible renewable energy source for human beings, and it is also a clean energy source that does not produce any environmental pollution. Solar cells are the fastest-growing and most dynamic practical application in recent years, and the production of solar cells is mainly based on silicon wafers. Its working principle is to use silicon wafers to absorb light energy and generate photoelectric conversion reactions. Silicon wafers, also known as wafers, are processed from silicon ingots. [0003] The existing cutting device for silicon wafers has relatively single function, cannot polish the silicon wafer well after cutting, and debris is prone to fly randomly during the cutting process, which affects the working environment. Contents of the invention [0004] The...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/00B28D5/04B24B21/00B24B7/02B24B7/04
CPCB24B21/002B28D5/00B28D5/0076B28D5/0082B28D5/045
Inventor 肖小勇
Owner 肖小勇
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com