Etching equipment with middle barrier plate

Abstract

The invention discloses etching equipment with a middle barrier plate. The etching equipment comprises an etching chamber and a steam treatment device, the etching chamber comprises a lower etching chamber and an upper etching chamber; and the lower etching chamber is communicated with the upper etching chamber; the steam treatment device comprises the middle barrier plate fixed between the frontside wall and the rear side wall of the upper etching chamber; a plurality of isosceles trapezoid-shaped ventilation holes which are uniformly distributed left and right, penetrate up and down and arenarrow in upper part and wide in lower part, are formed in the middle barrier plate; the side lines, close to each other, of the lower end openings of a pair of adjacent vent holes coincide; a suction unit is arranged on the middle barrier plate in a left-right moving manner, and comprises an upper baffle and a lower baffle; the upper baffle and the lower baffle seal the upper opening and the lower opening of the same vent hole; and a falling groove is formed in the upper end face of the lower baffle.

Description

technical field [0001] The invention relates to the technical field of etching equipment, in particular to an etching equipment with an intermediate barrier plate. Background technique [0002] The manufacturing process of the array substrate is mainly divided into five major processes: cleaning, film formation, exposure and development, etching, and stripping. Among them, the etching process is divided into dry etching and wet etching, and wet etching is widely used in the etching of metal thin films and oxide thin films. The wet etching process mainly refers to a technology that uses chemical liquid to remove the etchant. When the substrate to be etched is wet-etched, the chemical solution reacts with the etchant to remove the film not covered by the photoresist, thereby realizing electrode patterning. [0003] Wet etching equipment usually uses acidic etching liquid to spray the etching liquid onto the surface of the substrate to be etched through the nozzle, and chemic...

AI Technical Summary

Problems solved by technology

However, in the actual production process, the sprayed and volatilized etching liquid droplets will adhere to the cover plate of the etching equipment, and the etching liquid droplets attached to the etching equipment cover plate will gradually accumulate, forming more and more Large droplets of etching solution will eventually drop on the substrate to be etched, resulting in uneven etching and seriously affecting the yield of products

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