A tinning equipment for ultra-thin chip packaging process

Abstract

The invention discloses a tinning device used for ultra-thin chip packaging technology, which comprises a tinning device placed on the ground and a cylinder fixedly connected to the top of the ground, the output end of the cylinder is fixedly connected with a horizontal plate, and the horizontal plate A guide mechanism is provided through the top of the board, and a screw linear module is provided at the bottom of the horizontal board. The present invention achieves the purpose of automatic operation through the use of the screw linear module and the cylinder. In actual use, the height of the horizontal plate is adjusted through the cylinder, and the height of the workpiece in the filter box is further adjusted, and then driven by the drive motor 1. The slider drives the workpiece placed in the filter box to move left and right, and further enables the workpiece in the filter box to enter the degreasing tank, cleaning tank and tinning tank in turn for a complete tinning operation, so that the ultra-thin The tinning equipment for the chip packaging process has the advantages of saving time and labor and high work efficiency.

Description

technical field [0001] The invention relates to the technical field of chip production and processing, in particular to a tinning device used in an ultra-thin chip packaging process. Background technique [0002] Chips, also known as microcircuits, microchips, and integrated circuits, refer to silicon chips containing integrated circuits. They are small in size and are often part of computers or other electronic equipment. The most advanced integrated circuits are microprocessors or multi-core processors. The "core" of the computer can control everything from computers to mobile phones to digital microwave ovens. Memory and ASIC are examples of other integrated circuit families that are very important for the modern information society. Although the cost of designing and developing a complex integrated circuit is very high, when dispersed to Cost per IC is minimized, typically in millions of products. The performance of IC is high, because the small size brings short paths,...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a tinning equipment for ultra-thin chip packaging process, which has the advantages of saving time and effort and high work efficiency, and solves the problem of using multiple workers to cooperate in the packaging of existing ultra-thin chips. Picking up parts, degreasing, cleaning, and tinning operations, the entire operation process is not only time-consuming and laborious, but also has low work efficiency, which is not conducive to long-term industrial production

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