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Hollow particles, method for producing same, and usage of same

A manufacturing method and hollow technology, which is applied in the preparation of microspheres, microcapsule preparations, instruments, etc., can solve the problems of reduced mechanical strength and surface scratch resistance of formed objects, and achieve the effect of preventing the hollow part from being crushed

Active Publication Date: 2020-11-06
SEKISUI PLASTICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003]However, when hollow particles are added to a thermosetting or thermoplastic resin and molded, or added to an ultraviolet curable resin to form a film, there are The problem that the mechanical strength of the molded product, especially the scratch resistance of the surface decreases

Method used

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  • Hollow particles, method for producing same, and usage of same
  • Hollow particles, method for producing same, and usage of same
  • Hollow particles, method for producing same, and usage of same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0265](1) Add 1440 parts by mass of ion-exchanged water, 2.4 parts by mass of sodium p-styrenesulfonate, and 0.8 parts by mass of potassium persulfate to a 2L reactor equipped with a stirrer and a thermometer, raise the temperature to 70°C, and replace the internal system with nitrogen. into a nitrogen atmosphere. Mix 70.4 parts by mass of glycidyl methacrylate, 9.6 parts by mass of 3-methacryloxypropyl triethoxysilane, 1.6 parts by mass of n-octyl mercaptan, and 80 parts by mass of toluene, and use internal ultrasonic The mixed solution was irradiated with ultrasonic waves for 10 minutes by an emulsifier (manufactured by Branson Corporation, model number: SONIFIER 450) to perform forced emulsification. Emulsion polymerization was performed for 2 hours while stirring in a reactor heated to 70°C. At this stage, a large number of epoxy groups remain in the particles.

[0266] Next, in order to superpose|polymerize the epoxy group which remained, 40 mass parts of ethylenediamin...

Embodiment 2

[0270] A hollow particle isopropanol dispersion was obtained in the same manner as in Example 1, except that the polymerization temperature after adding ethylenediamine was 70° C. and the polymerization time was 40 hours. The amount of epoxy groups remaining after the phase separation step was 0.45 mmol / g. Observation with a transmission electron microscope revealed spherical particles with cavities inside. The dispersed particle size of the above-mentioned hollow particles in isopropanol was 103 nm, and the hollow rate was 42% by volume. In addition, the residual amount of unreacted epoxy groups in the hollow particles in isopropanol was 0.006. In addition, the total light transmittance of the cured product containing hollow particles is as high as 95.0%. In addition, the appearance of the hollow particle-containing cured product after the alkali resistance test was the same as that of the surrounding area, and it was a cured product excellent in alkali resistance.

Embodiment 3

[0272] Except changing ethylenediamine into diethylenetriamine, it carried out similarly to Example 2, and obtained the hollow particle isopropanol dispersion liquid. The amount of epoxy groups remaining after the phase separation step was 0.62 mmol / g. Observation with a transmission electron microscope revealed spherical particles with cavities inside. The dispersed particle size of the above-mentioned hollow particles in isopropanol was 106 nm, and the hollow rate was 44% by volume. In addition, the residual amount of unreacted epoxy groups in the hollow particles in isopropanol was 0.009. In addition, the total light transmittance of the cured product containing hollow particles is as high as 95.1%. In addition, the appearance of the hollow particle-containing cured product after the alkali resistance test was the same as that of the surrounding area, and it was a cured product excellent in alkali resistance.

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Abstract

Hollow particles having a shell composed of at least one or more layers and having an average particle diameter of 10-150 nm, wherein the ratio beta of the absorbance (A908) in an infrared absorptionspectrum of 908 cm<-1> and the absorbance (A1722) in an infrared absorption spectrum of 1722 cm<-1> (absorbance ratio beta: A908 / A1722) is 0.1 or less, the infrared absorption spectra being obtained by measuring the hollow particles through ATR-FTIR.

Description

technical field [0001] The present invention relates to hollow particles, their production method and their use. More specifically, the present invention relates to hollow particles which are obtained by adjusting the amount of epoxy groups remaining in the hollow particles and are hardly deformed even when added to a resin or the like, a method for producing the same, and uses thereof. Background technique [0002] Particles having voids inside are used as microcapsule particles by incorporating various substances in the voids thereof. In addition, these particles having voids inside are also called hollow particles, which are used as light scattering materials, low reflection materials, heat insulating materials, low dielectric constant materials, and the like. These materials are used, for example, as light-scattering films, low-reflection films, heat-insulating films, low-dielectric Constant thin films, etc. [0003] However, when hollow particles are added to a therm...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B01J13/14C08G59/32C08G65/26C09D7/65C09D201/00
CPCC08G59/32C08G59/5006C08G65/18C09D5/006C09D7/70C09D7/65B01J13/14B01J13/203C08G65/26C09D201/00G02B1/18C08F220/325B01J13/185C08F2800/20C09D133/14F16L59/028
Inventor 大内卓太野田百夏片山悠吾松浦春彦
Owner SEKISUI PLASTICS CO LTD