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Heat conduction block and cold conduction block fixing structure of semiconductor refrigeration device

A refrigeration device and a fixed structure technology, applied in the direction of refrigerators, refrigeration and liquefaction, heating and refrigeration combination, etc., can solve the problems of increasing thermal resistance and reducing the efficiency of semiconductor refrigeration chips

Inactive Publication Date: 2020-11-13
CHINA JILIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The former can effectively provide the assembly pressure required by the semiconductor refrigeration sheet and reduce the thermal resistance at both ends. However, due to the large heat transfer coefficient of metal bolts, the penetrating screw connection will directly increase the heat exchange between the hot end and the cold end, thus Reduce the efficiency of the semiconductor cooling sheet; the latter can avoid the heat exchange caused by the contact between the hot end and the cold end by bonding, but the adhesive force is not enough to make the heat conduction block and the cold conduction block fully contact with the cooling sheet, thereby increasing the heat at both ends resistance, reducing the efficiency of the semiconductor cooler

Method used

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  • Heat conduction block and cold conduction block fixing structure of semiconductor refrigeration device
  • Heat conduction block and cold conduction block fixing structure of semiconductor refrigeration device
  • Heat conduction block and cold conduction block fixing structure of semiconductor refrigeration device

Examples

Experimental program
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Effect test

Embodiment 1

[0044] Embodiment 1: Reference figure 1 and figure 2 , and the overall fixed structure from top to bottom is cold conducting plate 7, cold end heat insulating block 5, cold conducting block 3, semiconductor refrigeration sheet 1, heat conducting block 2, hot end heat insulating insert 4 and heat sink 6, this embodiment The heat sink 6 used in the above is a close-toothed heat sink. In actual application, a heat dissipation fan can be added to improve the working efficiency of the semiconductor cooling chip 1; the cold guide plate 7 used in this embodiment is a plate-shaped structure for increasing the cold conduction area. Other forms of cooling devices can be replaced during application. refer to Figure 3 to Figure 6, the hot-end heat-insulating block 5 and the cold-end heat-insulating block 4 are respectively embedded in the hot-end embedding groove 13 and the cold-end embedding groove 14, and are effectively locked through the corresponding hot-end fixing screw holes 8 ...

Embodiment 2

[0045] Embodiment two: reference Figure 7 to Figure 10 , it should be noted that the structure of the heat insulating slug in the second embodiment is the same as that in the first embodiment, only the specification ratio is different, so the image 3 Figure 4 Just as a reference. refer to Figure 7 and Figure 8 , the overall fixed structure from top to bottom is the cold-conducting plate 7, the cold-conducting block 3, the cold-end heat-insulating block 5, the semiconductor refrigeration sheet 1, the heat-conducting block 2, the hot-end heat-insulating block 4, and the heat sink 6. This embodiment The heat sink 6 used in the above is a close-toothed heat sink. In actual application, a heat dissipation fan can be added to improve the working efficiency of the semiconductor cooling chip 1; the cold guide plate 7 used in this embodiment is a plate-shaped structure for increasing the cold conduction area. Other forms of cooling devices can be replaced during application. ...

Embodiment 3

[0046] Embodiment three: reference Figure 11 and Figure 12 , and the overall fixed structure from top to bottom is cold conducting plate 7, cold end heat insulating block 5, cold conducting block 3, semiconductor refrigeration sheet 1, heat conducting block 2, hot end heat insulating insert 4 and heat sink 6, this embodiment The heat sink 6 used in the above is a close-toothed heat sink. In actual application, a heat dissipation fan can be added to improve the working efficiency of the semiconductor cooling chip 1; the cold guide plate 7 used in this embodiment is a plate-shaped structure for increasing the cold conduction area. Other forms of cooling devices can be replaced during application. refer to Figure 13 to Figure 15 , the hot-end heat-insulating block 5 and the cold-end heat-insulating block 4 are respectively embedded in the hot-end embedding groove 13 and the cold-end embedding groove 14. Here, the hot-end fixing screw hole 8 and the cold-end fixing screw hole...

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Abstract

The invention discloses a heat conduction block and cold conduction block fixing structure of a semiconductor refrigeration device. Different from a traditional semiconductor refrigeration device fixing piece, a heat conduction block and a cold conduction block are sleeved with a hot end heat insulation insert block and a cold end heat insulation insert block correspondingly, the heat conduction block and the cold conduction block are firmly fixed to the corresponding insert blocks through fastening screws, the hot end heat insulation block and the cold end heat insulation block are connectedthrough a fastening bolt, and fixing of the whole device is achieved. Through the design of the heat insulation insert blocks, the device can be effectively fixed, and the work efficiency of a refrigeration sheet is improved; and the heat transfer distance between the hot end and the cold end is obviously increased through a heat transfer block and the heat insulation insert blocks, the problem ofcold and hot end heat exchange caused by a penetrating type screw joint manner of the traditional semiconductor refrigeration device fixing piece is solved, the structure is simple, cost is low, andmatching is easy.

Description

technical field [0001] The invention relates to the technical field of semiconductor refrigeration, in particular to a fixing structure for a heat conduction block and a cold conduction block of a semiconductor refrigeration device. Background technique [0002] At present, in view of the rise of the theme of green environmental protection, semiconductor refrigeration technology has gradually entered the public's field of vision, such as small and exquisite semiconductor refrigeration refrigerators, semiconductor refrigeration mini cups, etc., but the core of these technologies is inseparable from semiconductor refrigeration chips, and its hot end and Cold end fixed structure. [0003] Traditional semiconductor refrigeration devices are generally fixed through penetrating screw connections, and some are fixed by bonding. The former can effectively provide the assembly pressure required by the semiconductor refrigeration sheet and reduce the thermal resistance at both ends. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F25B21/02F25B29/00
CPCF25B21/02F25B29/00
Inventor 杨俊伦
Owner CHINA JILIANG UNIV
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