Circuit board structure and manufacturing method thereof
A technology for circuit boards and flexible circuit boards, which is used in printed circuit manufacturing, multi-layer circuit manufacturing, and structural connection of printed circuits. Effect
Active Publication Date: 2022-04-01
UNIMICRON TECH CORP
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Problems solved by technology
[0004] The technical problem to be solved by the present invention is to provide a circuit board structure and its manufacturing method to solve the problems of signal transmission loss and insufficient heat dissipation capacity of the circuit board in the prior art, and then to meet the needs of high-frequency and high-speed technology
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[0088] In order to make the description of the content of the present invention more detailed and complete, the following provides illustrative descriptions for the implementation modes and specific examples of the present invention; but this is not the only form for implementing or using the specific embodiments of the present invention. The various embodiments disclosed below can be combined or replaced with each other when beneficial, and other embodiments can also be added to one embodiment, without further description or illustration.
[0089] In the following description, numerous specific details will be set forth in order to enable readers to fully understand the following embodiments. However, embodiments of the invention may be practiced without these specific details. In other instances, well-known structures and devices are only schematically shown in order to simplify the drawings.
[0090] In addition, in each embodiment of the present invention, component symbo...
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The invention discloses a circuit board structure and a manufacturing method thereof, wherein the circuit board structure comprises: a first flexible circuit board, a second flexible circuit board and a hard board structure. The first flexible circuit board includes a first dielectric layer and a first conductive circuit. The second flexible circuit board includes a second dielectric layer and a second conductive circuit. The rigid board structure connects the first flexible circuit board and the second flexible circuit board, and includes a third dielectric layer and a third conductive circuit. The dielectric loss value of the third dielectric layer is lower than the dielectric loss values of the first dielectric layer and the second dielectric layer. The third conductive circuit is electrically connected to the first conductive circuit and the second conductive circuit. The circuit board structure of the present invention has lower signal transmission loss and is suitable for the application requirements of high-frequency and high-speed circuit boards.
Description
technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a circuit board structure and a manufacturing method thereof. Background technique [0002] In response to the development trend of the printed circuit board industry, the design and development of high-frequency and high-speed circuit board materials and circuit boards has become the primary goal of pursuing high-frequency and high-speed technology in the future. However, current high-frequency and high-speed circuit boards still have problems such as signal transmission loss and heat dissipation. [0003] Therefore, it is necessary to propose solutions to the problems of signal transmission loss and heat dissipation of high-frequency and high-speed circuit boards, so as to meet the needs of future high-frequency and high-speed technologies. Contents of the invention [0004] The technical problem to be solved by the present invention is to provide a circuit bo...
Claims
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IPC IPC(8): H05K1/02H05K1/14H05K3/46
CPCH05K1/024H05K1/147H05K3/4691
Inventor 曾子章王佰伟谢清河李少谦李国维
Owner UNIMICRON TECH CORP