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Heat dissipation device of switch

A technology for heat sinks and switches, applied in the direction of selection devices, electrical components, etc., can solve the problem of inconvenient re-application of silicone grease, and achieve the effect of improving convenience and practicability

Inactive Publication Date: 2020-11-20
西安德创自动化工程有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a heat sink for switches to solve the inconvenient problem of reapplying silicon grease in the above-mentioned background technology

Method used

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  • Heat dissipation device of switch
  • Heat dissipation device of switch
  • Heat dissipation device of switch

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] A heat dissipation device for a switch, comprising a switch body 1, a heat dissipation hole 2, a rectangular slot 3, a main board 4, a processor 5 and a heat dissipation device body 6, the left and right sides of the switch body 1 are provided with heat dissipation holes 2, and two sets of heat dissipation holes 2 Rectangular grooves 3 are arranged on the inside, and a motherboard 4 is arranged inside the lower rectangular groove 3, and a processor 5 is installed on the top of the motherboard 4, the upper end of the processor 5 is attached to the bottom end of the heat sink body 6, and the heat dissipation holes 2 pass through the limit device Connected with the rectangular slot 3, the limiting device includes a second threaded rod 19, a second limiting block 20, a buckle slot 21, a buckle 22, a second rotating shaft 23 and a second rotating shaft slot 24, and the outside of the rectangular slot 3 is welded The second threaded rod 19, and two sets of second threaded rods...

Embodiment 2

[0026] The second connecting rod 14 is connected with the first connecting rod 8 through the rotating device, and the rotating device includes the first rotating shaft 9, the first stopper 10, the first stopper rod groove latch groove 11, the latch 12, the first stopper groove 13 and the second connecting rod 14, the inner surface of the second connecting rod 14 is all embedded with the first limit block groove 13, and the two groups of first limit block grooves 13 are all embedded with the first limit block 10, the first The surface of the limit block 10 is all embedded with the first limit rod groove latch groove 11, and the inside of the first limit rod groove latch groove 11 is inserted with a latch 12, and the latch 12 all runs through the first limit block groove 13 and the second limit block groove. The round hole that the top of the connecting rod 14 is provided, the bolt 12 is all set to another cylindrical shape, the top of the second connecting rod 14 and the second ...

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Abstract

The invention discloses a heat dissipation device of a switch. The heat dissipation device comprises a switch body, heat dissipation holes, rectangular grooves, a mainboard, a processor and a heat dissipation device body, the heat dissipation holes are formed in the left side and the right side of the switch body, the rectangular grooves are formed in the inner sides of the two heat dissipation holes, the mainboard is arranged in the lower rectangular groove, the processor is installed at the top end of the mainboard, and the upper end of the processor is attached to the bottom end of the heatdissipation device body. The first threaded rod is rotated; the first threaded rod drives the second lantern ring to move; the second lantern ring drives the heat dissipation device body to be removed from the surface of the processor, then the plug pin is pulled, the heat dissipation device body can rotate, the heat dissipation device body is rotated, the face, attached to the processor, of theheat dissipation device body faces upwards, and therefore the purpose of conveniently smearing silicone grease on the face, attached to the processor, of the heat dissipation device body is achieved,and the convenience of the device is improved.

Description

technical field [0001] The invention relates to the technical field of heat dissipation, in particular to a heat dissipation device for a switch. Background technique [0002] A switch is a network device used for photoelectric signal forwarding. It can provide an exclusive photoelectric signal path for any two network nodes connected to the switch. Generally, a large-scale switch will install a cooling device inside to dissipate heat from the processor. Now Some cooling devices for switches can basically meet the needs of daily use, but there are still some deficiencies that need to be improved. [0003] The surface of the processor shell is usually coated with silicone grease to improve the heat conduction efficiency between the processor and the heat sink. After using the device for a long time, the silicone grease on the surface of the processor will generally dry out and become invalid, and it is necessary to reapply the silicone grease. Generally, the cooling device o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04Q1/02
CPCH04Q1/02H04Q1/035
Inventor 李建飞
Owner 西安德创自动化工程有限公司