Active and passive dual-purpose liquid cooling radiator and manufacturing method thereof

Abstract

An active and passive dual-purpose liquid cooling radiator is used for heat dissipation of a chip and comprises a liquid cooling base and a heat pipe heat dissipation piece. The liquid cooling base iscomposed of a substrate and a cover plate, and a cooling water tank is arranged on the substrate; the heat pipe heat dissipation piece comprises a radiating block and a plurality of heat pipes; a plurality of heat dissipation air ducts are arranged on the side surface of the radiating block; the bottom surface of the radiating block is connected with the cover plate; the heat pipe is in a squarering shape, one long edge of the heat pipe transversely penetrates through the heat dissipation air ducts of the radiating block, and the other long edge of the heat pipe is located in the round hole.The active and passive dual-purpose liquid cooling radiator can be connected with a vehicle-mounted liquid cooling source, and efficient vehicle-mounted cooling is achieved; and field cooling can berealized by virtue of a self heat pipe cooling structure. According to the invention, the heat dissipation problem of the CPU chip of the communication equipment in a vehicle-mounted or field workingenvironment is solved. According to the manufacturing method of the radiator, through integral manufacturing, the thermal resistance of the radiator is the lowest, the heat dissipation performance isthe best, and normal use of communication equipment under vehicle-mounted or field conditions is ensured.

Description

technical field [0001] The invention relates to the technical field of chip heat sinks, in particular to an active and passive dual-purpose liquid cooling heat sink, and also relates to a manufacturing method of the heat sink. Background technique [0002] The CPU of high-power in-vehicle communication equipment generates a lot of heat during operation, and a good heat dissipation device is required to cool down the CPU. In order to save the space of communication equipment, the liquid cooling plate is directly attached to the CPU for efficient heat dissipation, but this must rely on the liquid cooling source on the vehicle. In order to meet the needs of field operations, it is sometimes necessary to take the communication equipment out of the vehicle for a short period of time. Since there is no liquid cooling source when used in the field, liquid cooling products cannot achieve efficient cooling of the CPU, which will seriously affect the normal operation of the communicat...

AI Technical Summary

Problems solved by technology

In order to meet the needs of field operations, sometimes it is necessary to take the communication equipment out of the compartment for a short period of time. Since there is no liquid cooling source in field use, liquid cooling products cannot achieve efficient CPU heat dissipation, which will seriously affect the normal operation of communication equipment

However, the existing technical solutions cannot solve the heat dissipation problem of such working conditions

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