The application discloses a
copper-embedded multilayer board defect detection method and
system based on
eddy current thermal imaging and
impedance spectrum fusion, relates to the technical field of multilayer board defect detection, and comprises the following steps: applying a high-frequency alternating
pulse magnetic field to a
copper-embedded multilayer board to be detected; continuously collecting thermal
field cooling sequence images after pulse excitation, then extracting thermal
diffusion coefficients of
copper-embedded regions a and thermal field isotheral line distribution characteristics; using test probes of an automatic
machine to contact copper-embedded blocks and corresponding network test points on the copper-embedded multilayer board to be detected, injecting a
wideband sweep
signal, obtaining
impedance spectrum and extracting characteristic parameters; and a , thermal field isotheral line
asymmetry, Z LF , R HF and Δ θ are constructed into a multi-dimensional
feature vector, input into a fusion judgment model, and a judgment result of the copper-embedded multilayer board defect is output according to a preset multiple threshold. The application realizes non-destructive defect detection, and the micro-crack
detection rate is about 97%, and the copper-embedded offset and interlayer short-circuit
detection rate is 100%.