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Polyimide film for OLED flexible substrate and preparation method of polyimide film

A polyimide film and flexible substrate technology, applied in the field of optical materials, can solve the problems of limiting the application of OLED flexible substrates, high glass transition temperature, low linear expansion coefficient, etc., to achieve regular arrangement and close stacking, low Effect of thermal expansion coefficient and high heat resistance thermal expansion coefficient

Active Publication Date: 2020-11-24
浙江中科玖源新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is difficult for polyimide materials at this stage to achieve both high glass transition temperature and low linear expansion coefficient, which limits its application in OLED flexible substrates.

Method used

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  • Polyimide film for OLED flexible substrate and preparation method of polyimide film
  • Polyimide film for OLED flexible substrate and preparation method of polyimide film
  • Polyimide film for OLED flexible substrate and preparation method of polyimide film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] A kind of polyimide film for OLED flexible substrate, its preparation method comprises:

[0021] S1. Under nitrogen protection, pour 40mmol 3,3',4,4'-biphenyltetracarboxylic dianhydride into 30mmol 2-(3-aminophenyl)-5-aminobenzimidazole and 10mmol diaminobenzene In the N,N-dimethylacetamide solution of anilide, stirring and reacting at room temperature for 8 hours, a polyamic acid solution with a solid content of 10wt% was obtained;

[0022] S2. Coat the polyamic acid solution obtained above on a glass plate, place the glass plate in a drying oven, heat up to 80°C, dry for 1h, heat up to 200°C, dry for 2h, and wait until the temperature drops to 25°C Take out the glass plate, transfer the glass plate to a tube furnace, raise the temperature to 150°C, heat for 1h, then raise the temperature to 350°C, heat for 1.5h, then raise the temperature to 400°C, heat for 0.5h, cool down to 25°C and take it out. Place in water to remove the film, and then place the film in a drying...

Embodiment 2

[0025] A kind of polyimide film for OLED flexible substrate, the preparation method of this film is the same as embodiment 1, except that in step S1, 40mmol 4,4'-(hexafluoroisopropylene) diphthalic anhydride monomer is poured into the solvent There are 30mmol2-(3-aminophenyl)-5-aminobenzimidazole and 10mmol diaminobenzanilide in the N,N-dimethylacetamide solution, the relevant properties of the polyimide film thus obtained The test results are also shown in Table 1.

Embodiment 3

[0027] A polyimide film for OLED flexible substrates, the preparation method of the film is the same as in Example 1, except that in step S1, 40mmol 4,4'-oxydiphthalic anhydride monomer is poured into 30mmol 2-(3-aminophenyl)-5-aminobenzimidazole and 10mmol diaminobenzanilide in the N,N-dimethylacetamide solution, the relevant performance test of the polyimide film thus obtained The results are also shown in Table 1.

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Abstract

The invention provides a polyimide film for an OLED flexible substrate and a preparation method of the polyimide film. The glass transition temperature of the polyimide film is 400 DEG C or above, andthe linear thermal expansion coefficient is 15 ppm / K or below.

Description

technical field [0001] The invention relates to the technical field of optical materials, in particular to a polyimide film for an OLED flexible substrate and a preparation method thereof. Background technique [0002] Polyimide films for OLED flexible substrates require excellent high temperature resistance, strong dimensional stability, high modulus, and a thermal expansion coefficient less than or equal to that of inorganic quartz glass materials. However, it is difficult for current polyimide materials to achieve both high glass transition temperature and low linear expansion coefficient, which limits its application in OLED flexible substrates. Contents of the invention [0003] Based on the technical problems existing in the background technology, the present invention proposes a polyimide film for OLED flexible substrates and a preparation method thereof. The glass transition temperature of the polyimide film is above 400°C and the linear thermal expansion coefficie...

Claims

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Application Information

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IPC IPC(8): C08G73/10C08J5/18H01L51/00C08L79/08
CPCC08G73/1085C08G73/1007C08J5/18C08J2379/08H10K77/111Y02E10/549
Inventor 金文斌张群
Owner 浙江中科玖源新材料有限公司
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