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Solder ball with coating, ball mounting method and packaging method

A technology of solder balls and coatings, which is applied in the direction of assembling printed circuits, printed circuits, and electrical components with electrical components, can solve problems such as low efficiency, achieve high efficiency, and simplify the implantation process.

Inactive Publication Date: 2020-11-27
SUZHOU TF AMD SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the efficiency of spot soldering and then reflow is relatively low.

Method used

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  • Solder ball with coating, ball mounting method and packaging method
  • Solder ball with coating, ball mounting method and packaging method
  • Solder ball with coating, ball mounting method and packaging method

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Embodiment Construction

[0037] The application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain related inventions, rather than to limit the invention. It should also be noted that, for ease of description, only parts related to the invention are shown in the drawings.

[0038] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and embodiments.

[0039] As mentioned in the background technology, the ball planting method of spot welding first and then reflow is relatively inefficient, and how to provide a more efficient ball planting method will become the improvement direction of this application. Therefore, the present application provide...

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Abstract

The invention discloses a solder ball with a coating, a ball mounting method and a packaging method. The solder ball with the coating comprises a solder ball body, a soldering flux coating is arrangedoutside the solder ball body, and a hot melting protective coating is arranged outside the soldering flux coating. During ball mounting, the method comprises: firstly forming the solder balls with the coatings; placing the solder ball with the coating on a bonding pad of a substrate; and carrying out reflow soldering on the solder ball with the coating and the bonding pad. The spot welding link is omitted, the solder ball implantation process is simplified, and the efficiency is high.

Description

technical field [0001] The present application generally relates to the technical field of semiconductor manufacturing, and in particular relates to a coated solder ball, a ball planting method and a packaging method. Background technique [0002] For solder ball connection, the solder flux is placed on the corresponding pad of the printed circuit board, and the solder ball is placed after spot welding the solder flux. Prevent the solder balls from falling off from the corresponding pads of the printed circuit board, and finally perform reflow to complete the soldering, so that the solder balls are attached to the corresponding pads of the printed circuit board. However, the efficiency of spot soldering and then reflow is relatively low. Contents of the invention [0003] In view of the above defects or deficiencies in the prior art, it is desired to provide a coated solder ball, a ball planting method and a packaging method. [0004] In a first aspect, the present inven...

Claims

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Application Information

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IPC IPC(8): H05K3/34
CPCH05K3/3457H05K3/3463H05K3/3489H05K3/3494
Inventor 刘在福
Owner SUZHOU TF AMD SEMICON CO LTD
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