Solder ball with coating, ball mounting method and packaging method

A technology of solder balls and coatings, which is applied in the direction of assembling printed circuits, printed circuits, and electrical components with electrical components, can solve problems such as low efficiency, achieve high efficiency, and simplify the implantation process.
CN112004337AInactive Publication Date: 2020-11-27SUZHOU TF AMD SEMICON CO LTD
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Patent Information

Authority / Receiving Office
CN ยท China
Current Assignee / Owner
SUZHOU TF AMD SEMICON CO LTD
Publication Date
2020-11-27
Estimated Expiration
Not applicable ยท inactive patent

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Abstract

The invention discloses a solder ball with a coating, a ball mounting method and a packaging method. The solder ball with the coating comprises a solder ball body, a soldering flux coating is arrangedoutside the solder ball body, and a hot melting protective coating is arranged outside the soldering flux coating. During ball mounting, the method comprises: firstly forming the solder balls with the coatings; placing the solder ball with the coating on a bonding pad of a substrate; and carrying out reflow soldering on the solder ball with the coating and the bonding pad. The spot welding link is omitted, the solder ball implantation process is simplified, and the efficiency is high.
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Description

technical field

[0001] The present application generally relates to the technical field of semiconductor manufacturing, and in particular relates to a coated solder ball, a ball planting method and a packaging method. Background technique

[0002] For solder ball connection, the solder flux is placed on the corresponding pad of the printed circuit board, and the solder ball is placed after spot welding the solder flux. Prevent the solder balls from falling off from the corresponding pads of the printed circuit board, and finally perform reflow to complete the soldering, so that the solder balls are attached to the corresponding pads of the printed circuit board. However, the efficiency of spot soldering and then reflow is relatively low. Contents of the invention

[0003] In view of the above defects or deficiencies in the prior art, it is desired to provide a coated solder ball, a ball planting method and a packaging method.

[0004] In a first aspect, the present inven...

Claims

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