Packaging detection equipment with automatic clamping function for semiconductor

Abstract

The invention discloses packaging detection equipment with an automatic clamping function for a semiconductor. The equipment comprises a main body frame, and an air cylinder is mounted in the middle of the lower part in the main body frame; a movable groove is formed in the upper part of an air rod; a sliding groove is formed in the right side of a fixed shaft; a steering block is mounted on the right side of a guide block; a first sliding rod is welded to the left side of the steering block; a push block is mounted below the left side of the fixed shaft; compared with the existing common semiconductor packaging detection equipment, the packaging detection equipment with the automatic clamping function for the semiconductor. has the advantages that the sliding groove is arranged; when thesteering block moves upwards, the guide block moves along the sliding groove, and when the guide block moves to the middle of the sliding groove, the sliding groove spirally ascends, the rotating angle is 120 degrees, the first sliding rod is driven to rotate by 120 degrees, rotation of one procedure is completed, automation of packaging detection is achieved, and the detection efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of package inspection, in particular to a package inspection device with automatic clamping function for semiconductors. Background technique [0002] With the progress of society, the development of economy, and the continuous improvement of science and technology, the high efficiency and convenience of semiconductors are applied in various fields. In order to improve the stability of semiconductors in work, it is necessary to package and test semiconductors. Post-packaging test, the process of confirming the structure and electrical functions of the manufactured semiconductor components to ensure that the semiconductor components meet the requirements of the system is called post-packaging testing. At present, the packaging and testing equipment of semiconductors cannot realize the automatic clamping function of semiconductor boards. , can not meet people's needs well, in view of the above situation, techn...

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Problems solved by technology

[0003] The purpose of the present invention is to provide a packaging inspection device with automatic clamping function for semiconductors, so as to solve the general problem that the automatic clamping function of semiconductor plates cannot be realized in the above-mentioned background technology and cannot well meet people's use needs.

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