Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Etching solution recycling device and utilization method thereof

A technology of etching solution and etching tank, which is applied in chemical/electrolytic methods to remove conductive materials, manufacture electrical components, printed circuits, etc., can solve the problems of reducing the volume of etching solution, increasing etching costs, and reducing etching efficiency, etc., to achieve Improve etching efficiency, reduce etching cost, and compact structure

Pending Publication Date: 2020-12-01
四川睿杰鑫电子股份有限公司
View PDF5 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] After the worker salvages the circuit board, a large amount of etching solution will inevitably adhere to the surface of the circuit board. In order to keep the surface clean, the worker will use clear water to wash away the etching solution attached to the surface of the circuit board to ensure the cleanliness of the product. , which undoubtedly causes the volume of the etching solution in the etching tank to decrease, and new etching solution needs to be continuously replenished later, which undoubtedly increases the etching cost
In addition, during the etching process, the concentration of the etching solution around the circuit board gradually decreases, and the etching solution is not flowing, so it takes a long time to complete the etching, which undoubtedly reduces the etching efficiency and reduces the PCB board. production efficiency

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Etching solution recycling device and utilization method thereof
  • Etching solution recycling device and utilization method thereof
  • Etching solution recycling device and utilization method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] The present invention will be further described below in conjunction with accompanying drawing, protection scope of the present invention is not limited to the following:

[0032] Such as Figure 1~7 Shown, a kind of etchant reuse device, it comprises gantry 1 and is arranged on the etching groove 2 below gantry 1 crossbeam, is provided with drain valve 29 on the side wall of gantry 1 crossbeam, and described gantry 1 crossbeam A lifting cylinder 3 is fixedly installed on the top, and a lifting plate 4 is welded on the working end of the piston rod of the lifting cylinder 3. A hollow tube 5 is fixedly installed on the lifting plate 4. The lower end of the hollow tube 5 runs through the beam and is welded on the extension end The carrier plate 6 located directly above the etching groove 2 is provided with a closed cavity 7 connected to the hollow tube 5 in the carrier plate 6. The top of the carrier plate 6 is welded with a plurality of carrier platforms 8 distributed in...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an etching solution recycling device, which comprises a gantry (1) and an etching tank (2) arranged below the cross beam of the gantry (1), wherein a lifting oil cylinder (3) is fixedly mounted at the top of the cross beam of the gantry (1), a lifting plate (4) is welded at the acting end of the piston rod of the lifting oil cylinder (3), the lower end portion of a hollow pipe (5) penetrates through the cross beam, a bearing disc (6) positioned right above the etching tank (2) is welded at the extending end, a plurality of bearing tables (8) distributed in an array modeare welded to the top of the bearing disc (6), a longitudinally-formed groove (9) is formed in the top of each bearing table (8), a circuit board (10) is inserted into each groove (9), and nozzles (11) located on the bearing disc (6) are arranged on the left side and the right side of each bearing table (8). The etching solution recycling device has the beneficial effects that the structure is compact, the etching efficiency is greatly improved, the etching cost is greatly reduced, and the operation is simple.

Description

technical field [0001] The invention relates to the technical field of circuit board etching, in particular to an etchant recycling device and a utilization method thereof. Background technique [0002] The circuit board is an important part of the electric vehicle circuit unit, and its design is mainly layout design; the main advantage of the circuit board is that it greatly reduces the errors of wiring and assembly, and improves the automation level and production labor rate. The core process of the circuit board manufacturing process is etching. The required circuit pattern can be made on the circuit board through the etching process. Before etching the circuit board, tape is used to paste the adhesive layer on the substrate of the circuit board to block the area that does not need to be etched. Then soak the entire substrate into the etching tank filled with etching solution. After a period of etching, the circuit layer can be etched on the substrate to form the required...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/06
CPCH05K3/068
Inventor 夏东
Owner 四川睿杰鑫电子股份有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products