Bonding-free electronic tag chip packaging method

Abstract

The invention belongs to the technical field of electronic tag chip packaging, and particularly relates to a bonding-free electronic tag chip packaging method. An automatic packaging device used in the bonding-free electronic tag chip packaging method comprises a conveying belt, a support, base plates, a dispensing module, a hot pressing module and a controller, the conveying belt is fixedly connected to the support, the controller is further arranged on the support, the controller is used for controlling the automatic packaging device to operate automatically, a set of check blocks are arranged on the conveying belt, the base plate is placed between every two check blocks, the dispensing module is located in the middle of the conveying belt, the hot pressing module is located at one sideof the dispensing module, and the dispensing module and the hot pressing module are both fixedly connected to the support. The base plates are placed into the automatic packaging device, the controller controls the conveying belt, the dispensing module and the hot-pressing module to be matched, an RFID antenna and an RFID chip are subjected to dispensing and hot-pressing packaging automatically, the work flow is stable and accurate, and the work efficiency is improved.

Description

technical field [0001] The invention belongs to the technical field of electronic tag chip packaging, in particular to a non-bonding electronic tag chip packaging method. Background technique [0002] The full name of the electronic tag is RFID (Radio Frequency Identification, radio frequency identification) tag, that is, radio frequency identification tag. RFID radio frequency identification is a non-contact automatic identification technology. It automatically identifies the target object and obtains relevant data through radio frequency signals. The identification work does not require manual intervention and can work in various harsh environments. RFID technology can identify high-speed moving objects and can identify multiple electronic tags at the same time. The operation is fast and convenient, and it is frequently used in supermarkets. [0003] The structure of the electronic tag is composed of an RFID chip, an RFID antenna, a base material, and the outer packaging ...

AI Technical Summary

Problems solved by technology

[0005] This patent improves the packaging quality of electronic label chips and reduces the cost of packaging processing; however, this patent cannot solve the problem of manual operation of electronic label chip packaging, which may lead to unstable workflow due to factors such as proficiency and technical level, uneven glue dispensing, and chip placement. Wrong phenomenon, reduce work efficiency; accordingly, the present invention proposes a kind of non-bonded electronic label chip packaging method

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