Bonding-free electronic tag chip packaging method

A label chip, packaging method technology, applied in the direction of circuits, electrical components, electrical solid devices, etc., can solve the problems of wrong chip placement, uneven dispensing, and reduced work efficiency.

Inactive Publication Date: 2020-12-04
张晓宇
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] This patent improves the packaging quality of electronic label chips and reduces the cost of packaging processing; however, this patent cannot solve the problem of manual operation of electronic label chip packaging, which may lead to unstable...

Method used

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  • Bonding-free electronic tag chip packaging method
  • Bonding-free electronic tag chip packaging method
  • Bonding-free electronic tag chip packaging method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach

[0046] As an embodiment of the present invention, the bottom end of the chute 42 is fixedly connected to the limit plate 43, the shape of the end of the limit plate 43 close to the bracket 4 is consistent with the shape of the chute 42, and the middle part of the limit plate 43 is provided with a screw thread Hole, limiting plate 43 middle part is connected with adjusting screw 44 by screw thread, and the afterbody of described adjusting screw 44 is provided with gasket 45, and described gasket 45 is made of elastic material, and gasket 45 contacts with gas cylinder 76 bottom surfaces; During work, The amount of conductive glue injected by the dispensing module 6 into the base plate 5 depends on the expansion and contraction of the gas rod 77. Since the stroke of the positioning plate 73 is consistent each time, the amount of glue injected by the glue dispensing module 6 remains unchanged. All can affect the encapsulation quality of RFID chip 2 when being too much or too little...

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PUM

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Abstract

The invention belongs to the technical field of electronic tag chip packaging, and particularly relates to a bonding-free electronic tag chip packaging method. An automatic packaging device used in the bonding-free electronic tag chip packaging method comprises a conveying belt, a support, base plates, a dispensing module, a hot pressing module and a controller, the conveying belt is fixedly connected to the support, the controller is further arranged on the support, the controller is used for controlling the automatic packaging device to operate automatically, a set of check blocks are arranged on the conveying belt, the base plate is placed between every two check blocks, the dispensing module is located in the middle of the conveying belt, the hot pressing module is located at one sideof the dispensing module, and the dispensing module and the hot pressing module are both fixedly connected to the support. The base plates are placed into the automatic packaging device, the controller controls the conveying belt, the dispensing module and the hot-pressing module to be matched, an RFID antenna and an RFID chip are subjected to dispensing and hot-pressing packaging automatically, the work flow is stable and accurate, and the work efficiency is improved.

Description

technical field [0001] The invention belongs to the technical field of electronic tag chip packaging, in particular to a non-bonding electronic tag chip packaging method. Background technique [0002] The full name of the electronic tag is RFID (Radio Frequency Identification, radio frequency identification) tag, that is, radio frequency identification tag. RFID radio frequency identification is a non-contact automatic identification technology. It automatically identifies the target object and obtains relevant data through radio frequency signals. The identification work does not require manual intervention and can work in various harsh environments. RFID technology can identify high-speed moving objects and can identify multiple electronic tags at the same time. The operation is fast and convenient, and it is frequently used in supermarkets. [0003] The structure of the electronic tag is composed of an RFID chip, an RFID antenna, a base material, and the outer packaging ...

Claims

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Application Information

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IPC IPC(8): H01L21/50H01L21/67H01L21/68H01L21/687H01L21/603G06K19/077
CPCG06K19/077G06K19/07745G06K19/0775G06K19/07775H01L21/50H01L21/6715H01L21/68H01L21/68742H01L24/75H01L2224/753
Inventor 张晓宇周晨庞敏
Owner 张晓宇
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