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Waterproof heat dissipation air duct structure and electronic device

A technology for heat dissipation air ducts and electronic equipment, which is applied to structural parts of electrical equipment, electrical components, cooling/ventilation/heating transformation, etc., and can solve problems such as impossibility of waterproofing and need for heat dissipation

Pending Publication Date: 2020-12-11
SHENZHENTRENDWOOTECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Based on this, it is necessary to address the above problems and propose a waterproof heat dissipation air duct structure and electronic equipment, which solves the technical problem that electronic equipment in the prior art needs to dissipate heat but cannot be waterproofed

Method used

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  • Waterproof heat dissipation air duct structure and electronic device

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Embodiment Construction

[0022] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0023] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purpos...

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Abstract

The embodiment of the invention discloses a waterproof heat dissipation air duct structure and an electronic device, the waterproof heat dissipation air duct structure comprises an air duct shell, theair duct shell comprises a vertically arranged side wall and a top wall arranged at the top end of the side wall, the shell is provided with an accommodating cavity, an air inlet channel and an air outlet channel, and the accommodating cavity is used for accommodating a structural assembly of the electronic device; a first air inlet and a second air inlet are formed in the air inlet channel, thefirst air inlet penetrates through the side wall, and the second air inlet is communicated with the accommodating cavity and faces the top wall; the first air outlet and the second air outlet are formed in the air outlet channel, the first air outlet penetrates through the side wall, and the second air outlet is communicated with the accommodating cavity and faces the top wall. By applying the technical scheme, the technical problem that electronic device in the prior art needs heat dissipation but cannot prevent water is solved.

Description

technical field [0001] The invention relates to the technical field of heat dissipation, in particular to a waterproof heat dissipation air duct structure and electronic equipment. Background technique [0002] At present, high-power electronic devices are increasingly used outdoors. High-power electronic devices have heat dissipation requirements. Generally, heat dissipation is carried out through the cooling holes connected to the air duct. However, the cooling holes will make the electronic equipment lose its waterproof function, which will cause the It cannot work normally; at the same time, the use environment of electronic equipment is limited, that is, it cannot be used in an outdoor environment under wind and rain. Contents of the invention [0003] Based on this, it is necessary to address the above problems and propose a waterproof heat dissipation air duct structure and electronic equipment, which solves the technical problem that the electronic equipment in the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20145
Inventor 汪洋叶亮文
Owner SHENZHENTRENDWOOTECH CO LTD
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