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A method for detecting the height of glue pouring

A detection method and glue filling technology, which is applied in the direction of electrical equipment casings/cabinets/drawers, small casings, electrical components, etc., can solve the problems of detection height, inability to use mechanical detection instruments, etc., and achieve high detection efficiency

Active Publication Date: 2021-08-24
XIAMEN HUALIAN ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is difficult or even impossible to use mechanical testing equipment to detect the height of products with low glue filling height, small qualified range and high precision of glue filling volume, so it is necessary to design a more suitable solution

Method used

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  • A method for detecting the height of glue pouring
  • A method for detecting the height of glue pouring
  • A method for detecting the height of glue pouring

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0066] refer to Figure 6 As shown, the gray glue 1 in the figure does not cover the second annular closed line 102, and the second annular closed line 102 can be clearly and completely identified. Therefore, through step A5, it can be directly determined that the glue filling height is too low and If it is unqualified, it needs to be replenished, and then re-tested to reach the qualified height.

Embodiment 2

[0068] refer to Figure 7 As shown, the gray glue 1 in the figure is very close to the second annular closed line 102, but due to reasons such as recognition, the second annular closed line 102 cannot be clearly and completely identified. At this time, it is necessary to perform step A6 again. Area calculation, if S is satisfied min ≤S≤S max That is qualified, the others are not qualified.

Embodiment 3

[0070] refer to Figure 8 As shown, the gray glue 1 in the figure just reaches the second closed loop line 102, but due to reasons such as recognition degree, the second closed loop line 102 cannot be clearly and completely identified. At this time, step A6 needs to be carried out again. Area calculation, if S is satisfied min ≤S≤S max That is qualified, the others are not qualified.

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Abstract

The invention provides a method for detecting the glue filling height. The detection method includes the potting tank, the potting tank includes the packaging tank body, the packaging tank body is formed with a packaging area, the side wall of the packaging tank body is an inclined tank side wall, and the groove depth of the packaging tank body is set to be equal to the minimum qualification of the potting tank. Height, there is also a first step surface on the periphery of the packaging tank, a second step surface is provided on the periphery of the first step surface, and the height from the second step surface to the bottom surface of the packaging tank is set to be equal to the highest qualified height of the glue filling ; the third annular closed line formed by the first step surface and the groove side wall of the packaging groove body, the fourth annular closed line formed by the first stepped surface and the second stepped surface, the third annular closed line and the fourth annular closed line as Determine the standard line for determining the height of the glue, and initially determine the height range of the glue. When the range cannot be clearly identified, then calculate the enclosed area of ​​the glue to determine whether the height of the glue is within the qualified range.

Description

technical field [0001] The invention relates to the field of packaging technology of components, in particular to a glue filling tank, a detection system and a detection method for detecting the glue filling height by using the glue filling tank. Background technique [0002] Now, our daily life or work is inseparable from electrical equipment. When producing electrical equipment, the internal components are generally packaged on the circuit board, and then filled with glue for fixing and sealing protection. In order to ensure the packaging stability of components and not affect the work of components, there are strict requirements on the amount of glue (such as the height of glue). [0003] Most of the existing glue filling heights are detected by mechanical testing instruments. This method is more suitable for situations where the glue filling height is high, the qualified range is large, and the accuracy is not high. However, it is difficult or even impossible to use mec...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K5/00H05K5/06
CPCH05K5/0095H05K5/064
Inventor 金范植肖玉根钟天禄
Owner XIAMEN HUALIAN ELECTRONICS CO LTD
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