High-resolution dislocation array ultrasonic b/c scanning detection device and method

Abstract

The invention relates to a high-resolution dislocation array ultrasonic B / C scanning detection device and method, belonging to the field of non-destructive testing. The detection device includes a dislocation array ultrasonic probe, an X-direction motion device, an ultrasonic acquisition card, a motor control card and an industrial computer. The dislocation array ultrasonic probe is connected with the ultrasonic acquisition card and the industrial computer to excite each ultrasonic vibration element to realize the emission of ultrasonic signals / receiving and signal processing; the X-direction motion device is connected with the motor control card and the industrial computer to control and feed back the motor movement, and realize the motion drive and position information collection of the dislocation array ultrasonic probe; the dislocation array ultrasonic probe is installed in the X direction On the movement device, and realize the X-direction movement under the drive of the X-direction movement device. The detection method combines the dislocation array ultrasonic probe with the X-direction motion device, and combines mechanical scanning and electronic scanning to finally realize the high-efficiency, high-resolution, and low-cost ultrasonic B / C scanning detection of the internal connection state of the workpiece.

Description

technical field [0001] The invention relates to the field of non-destructive testing, in particular to a high-resolution ultrasonic B / C scanning detection technology, in particular to a high-resolution dislocation array ultrasonic B / C scanning detection device and method. It can be used in technical fields such as automobiles, rail vehicles, aerospace, and pharmaceutical equipment. Background technique [0002] Ultrasonic B-scan and C-scan inspections are common non-destructive inspection methods for the internal state of workpieces. There are three common ultrasonic B / C scanning detection methods. One is to use a mechanical device to drive a single-point ultrasonic probe to scan the surface of the workpiece. When the scanning path is a straight line, the scanning data can form an ultrasonic B-scan Detection results; when the scanning path covers the surface of the workpiece, the scanning data can form the ultrasonic C-scan detection results. When the step points of the me...

AI Technical Summary

Problems solved by technology

This method has high detection accuracy and detection speed at the same time. However, due to the complexity of the phased array control method, the requirements for the ultrasonic control card and signal processing method are extremely high, which makes the cost of the phased array equipment relatively expensive, which limits this method. widespread use of technology

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