The specific embodiments of the present invention will be further described below with reference to the accompanying drawings.
 This application discloses a collaborative innovation platform for electronic manufacturing industry, and its principle block diagram is as follows figure 1 As shown, including the client side, the background management side and the supplier side.
 The client includes design tool cloud and IP service cloud. The design tool cloud is used to realize online circuit design, structural modeling, process simulation and layout drawing. The design tool cloud includes simulation software. Optionally, the simulation software is Intellisense software for collaborative innovation. In the later stage of the platform, it will gradually introduce diversified cooperation with well-known design simulation software at home and abroad, such as Ansys, Comsol, Covontorware, and Sugar. The IP service cloud integrates a variety of IP packages for designers to use directly. The IP packages are designed and packaged IC or MEMS modules. Optionally, the IP packages include characteristic process IP packages and special process IP packages for designers’ reference and can provide For optional services, designers can also design IP packages by themselves and provide them to the collaborative innovation platform. By setting up IP service cloud, designers can complete product design more efficiently and shorten product design time.
 The background management terminal includes an intelligent identification module connected to the design tool cloud, which is used to receive and decrypt the encrypted design files sent by the design tool cloud, and automatically match each supplier equipment that conforms to the product process flow and process parameters through the depth mapping algorithm according to the decrypted design file. , and generate the corresponding encrypted order and send it to the supplier.
Optionally, the background management terminal also includes a personnel/equipment management system, which is used to realize the classification management of the login identities of designers and suppliers, and to establish platform user information files, so as to facilitate the collaborative innovation platform management personnel information. It is also used to realize the classification management of each supplier's equipment and its corresponding process information, establish platform equipment information files, and facilitate the collaborative innovation platform to manage equipment information.
 The supplier side includes a digital twin cloud connected to the intelligent identification module, which is used to realize the online visualization of production scenarios, supplier equipment and production processes, and feed back the processing results to the client, so that the designer can track the production situation in full, and if there are problems The link has an actionable basis.
 Optionally, the supplier side also includes an online MES system. The online MES system communicates with the supplier's offline MES. The digital twin cloud also connects the offline manufacturing plant, the offline manufacturing plant connects to the online MES system, and the online MES system. It is used to comprehensively track and manage personnel, plans, materials, and equipment in offline manufacturing plants.
 The above-mentioned design tool cloud, IP service cloud and digital twin cloud are connected through industrial Internet communication, and the collaborative innovation platform connects designers with foundries (ie suppliers) based on "three clouds and one network".
 The present application also discloses a method for using a collaborative innovation platform for electronic manufacturing industry, and the method flow chart is as follows: figure 2 As shown, the method includes the following steps:
 Step 1: The designer designs the products required for simulation through the client's design tool cloud and IP service cloud, and the design files are encrypted by the collaborative innovation platform and transmitted to the background management terminal.
 Step 2: The intelligent identification module receives and decrypts the encrypted design file, automatically matches each supplier's equipment that conforms to the product process flow and process parameters through the depth mapping algorithm according to the decrypted design file, and generates a corresponding encrypted order to send to the supplier.
 The intelligent identification module establishes the corresponding relationship between the standardized processing process module and the supplier's equipment according to the industry standard process information and platform equipment information files. The standardized processing process module includes lithography, etching, thin film, injection and bonding, and the corresponding relationship includes the process flow. , the type of equipment involved in the technological process and the corresponding processing plant, please refer to Figure 5 , which shows the correspondence between the "etch" standardized process flow module and the supplier's equipment.
 This embodiment takes the "etching" process flow as an example to explain the automatic matching method, combined with image 3 and Figure 5 As shown, the first matching key field "ETC" is used to extract the process flow characteristics from the decrypted design file, and match with the standardized processing flow module to realize the matching of the process flow. At this time, the matching results of the collaborative innovation platform are multiple Supplier equipment that complies with the process flow. Utilize the second matching key field "RIE-Si 3 N 4 "Match the supplier equipment corresponding to the standardized processing process module. At this time, the matching result of the collaborative innovation platform is the supplier equipment that meets the process flow after further screening. Optionally, other matching key fields can also be used to perform layer-by-layer matching. Screening, so that the range of matching supplier equipment that meets the process is gradually narrowed. The third matching key field "Material is Si, strip width is 1.3±0.13um, measuring groove depth is 3.3um" is used to match product process parameters. Supplier equipment, at this time, the matching result of the collaborative innovation platform is the effective supplier equipment that meets the process flow and process parameters after further screening. Through the layer-by-layer matching screening, the scope of the qualified supplier equipment is narrowed, and the design documents are realized. It is automatically converted into supplier equipment that meets the processing conditions, and the designer can choose a supplier equipment according to the actual situation.
 Step 3: After decryption, the supplier side simulates the production scene, supplier equipment and production process through the digital twin cloud according to the product process flow, process parameters and corresponding supplier equipment recorded in the order, and generates a 3D panoramic display platform for online visualization. like Figure 4 As shown, the 3D panoramic display platform includes each supplier's equipment and its corresponding equipment parameters, as well as the actual temperature and humidity parameters of the production scene, and the 3D panoramic display platform feeds back the processing results to the client.
 Step 4: The designer checks the 3D panoramic display platform through the collaborative innovation platform, supervises the production process, and readjusts the product on the design tool cloud according to the processing results, and re-executes the steps of encrypting the design file by the collaborative innovation platform and transmitting it to the background management terminal. Until the product does not need to be adjusted, the final processed product is obtained.
 Among them, the decryption methods of the client, the background management end and the supplier end are the same, and the methods include:
 When the collaborative innovation platform is started, two key parameters are passed to the user according to the user's identity, which are the current user's personal key and the current user's enterprise key. The user's identity is obtained from the platform's user information file, including individual users and enterprise users.
 If the user identity is an individual user, the enterprise key to which the current user belongs is empty; if the user identity is an enterprise user, the collaborative innovation platform divides the permissions for the enterprise key of the current user according to the organizational affiliation between enterprises. The authority of the affiliated enterprise key to open the corresponding enterprise encrypted file or personal encrypted file that conforms to its own identity, or collaborate with the innovation platform to generate enterprise encrypted file or personal encrypted file that conforms to the user's identity. Cloud-generated design files and corporate intellectual property files, personal encrypted files include design files and personal intellectual property files generated by the design tool cloud saved in the personal name.
 When decrypting, first use the enterprise key to which the current user belongs to decrypt the enterprise encrypted file or personal encrypted file. If the decryption of the enterprise encrypted file fails, the enterprise encrypted file to be opened does not match the current user authority, or the current user does not belong to the enterprise. Then use the current user's personal key to decrypt the personal encrypted file.
 When the organizational affiliation between enterprises changes, the authority of the corresponding enterprise key to which the current user belongs will also change, that is, the key parameters are generated and disappeared together with the organizational affiliation between enterprises. Encrypted files will not be opened even if copied. The transmission of key parameters is inside the server set up by the collaborative innovation platform, and is not transmitted and stored by the user, so it is not easy to be stolen.
 Through the file encryption and decryption process of the collaborative innovation platform, and according to the organizational affiliation between enterprises, the authority of the enterprise key to which the current user belongs is opened, so there will be no leapfrog operations, leaving employees and outsiders unable to open encrypted files under the name of the enterprise , which ensures the security of enterprise encrypted files transmission and browsing on the platform.
 Optionally, the method further includes after step 3:
 The offline manufacturing factory conducts offline production according to the processing results and orders simulated by the digital twin cloud, and uses the online MES system to communicate with the supplier's offline MES to comprehensively track and monitor the personnel, plans, materials, and equipment of the offline manufacturing factory. Management can help suppliers to reasonably plan the production plan and shorten the entire production time.
 The electronic manufacturing collaborative innovation platform proposed in this application concentrates the production capacity and equipment in the IC or MEMS industry, and coordinates and unifies the R&D, manufacturing, packaging, and testing links to form a good closed-loop industry, and designers can track the whole process. The various production links and progress of the foundry (supplier), timely adjust its own design products, and finally obtain high-quality products. Compared with the traditional MEMS design and production process, it can effectively prevent the final products produced by the foundry from not meeting the designer's requirements. In anticipation of the requirements, the design documents of the designers are automatically matched to the supplier equipment that conforms to the product process and parameters through the intelligent identification module of the background management terminal, which solves the problem of difficult communication between the two and requires repeated communication and negotiation, and shortens the product processing time.
 The virtual electronic manufacturing collaborative innovation platform integrates design simulation software, integrated design IP, design result encryption, digital factory matching according to process flow and process parameters, online ordering, processing process tracking, processing result prosecution and integrated online MES systems. Function. The invention solves the problems of poor coordination, non-uniform standardization and normativeness of various links in the sensor industry, and realizes software-defined digital intelligent manufacturing SDM. To build a closed-loop chain of the entire electronics manufacturing industry, cooperate with the optimized industrial Internet of Things cloud, and build a complete electronics manufacturing ecosystem, which has broad development prospects.
 The above descriptions are only preferred embodiments of the present application, and the present invention is not limited to the above embodiments. It can be understood that other improvements and changes directly derived or thought of by those skilled in the art without departing from the spirit and concept of the present invention should be considered to be included within the protection scope of the present invention.