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Electronic manufacturing industry collaborative innovation platform and using method thereof

A manufacturing and platform technology, applied in the field of electronic manufacturing collaborative innovation platform, can solve the problem of not being able to participate in it and having to wait for the final result, and achieve the effect of shortening product design time, shortening product processing time, and ensuring safety

Active Publication Date: 2020-12-18
WUXI INNOVATION CENT CO LTD
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The traditional MEMS design process is for the designer to design a circuit or model on a single machine, and the generated result or structure is converted into a process flow and layout by relevant technical personnel, and then matched with the relevant technical personnel of the chip foundry to match the equipment and process of the factory. After repeated communication and adjustments between the two parties, the entire process matching can be completed. The price is then calculated according to the matching process, and the contract is finally determined. The designer basically cannot participate in the product production process and can only wait for the final result.

Method used

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  • Electronic manufacturing industry collaborative innovation platform and using method thereof
  • Electronic manufacturing industry collaborative innovation platform and using method thereof
  • Electronic manufacturing industry collaborative innovation platform and using method thereof

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Embodiment Construction

[0036] The specific embodiments of the present invention will be further described below in conjunction with the accompanying drawings.

[0037] This application discloses a collaborative innovation platform for the electronics manufacturing industry, its principle block diagram is as follows figure 1 As shown, including client, background management and supplier.

[0038] The client includes design tool cloud and IP service cloud. The design tool cloud is used to realize online circuit design, structural modeling, process simulation and layout drawing. The design tool cloud includes simulation software. Optionally, the simulation software is Intellisense software for collaborative innovation In the later stage of the platform, we will gradually introduce diversified cooperation with domestic and foreign well-known design simulation software such as Ansys, Comsol, Covontorware, Sugar, etc. The IP service cloud integrates a variety of IP packages for designers to use directly....

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PUM

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Abstract

The invention discloses an electronic manufacturing industry collaborative innovation platform and a using method thereof, and relates to the field of MEMS processing and manufacturing, the platform comprises a client, a background management terminal and a supplier terminal, the client comprises a design tool cloud and an IP service cloud, and the design tool cloud is used for online circuit design, structural modeling, process simulation and layout drawing. The IP service cloud is integrated into a plurality of IP packages for designers to directly use; the background management end comprises an intelligent identification module connected with the design tool cloud, and is used for decrypting the encrypted design file sent by the design tool cloud, automatically matching supplier equipment conforming to the technological process and parameters of the product through a deep mapping algorithm, generating a corresponding encrypted order and sending the encrypted order to the supplier terminal; and the supplier terminal comprises a digital twin cloud connected with the intelligent identification module, provides online visualization of a production scene, supplier equipment and a production flow, and feeds back a processing result to the client, and the collaborative innovation platform forms a closed-loop industrial chain to provide a collaborative communication platform for designers and suppliers.

Description

technical field [0001] The invention relates to the field of processing and manufacturing of MEMS and integrated circuits, in particular to a collaborative innovation platform for electronics manufacturing and a method for using the same. Background technique [0002] With the development of microfabrication technology of semiconductor integrated circuits and the advent of the ubiquitous information society, it marks the opening of the era of the Internet of Things. Driven by the rapid growth of industry, automobiles, medical care and products represented by smart phones, pressure sensors , accelerometers, gyroscopes, optical devices and other MEMS products account for a relatively high market share, and network communications and automotive electronics have become the most active application areas of China's MEMS market segments. [0003] The traditional MEMS design process is for the designer to design a circuit or model on a single machine, and the generated result or str...

Claims

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Application Information

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IPC IPC(8): G06F30/39G06Q10/10H04L29/08
CPCG06Q10/101G06Q10/103G06F30/39H04L67/10
Inventor 卢狄克陈蓉薛沁陈普查陈大鹏
Owner WUXI INNOVATION CENT CO LTD
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