Aluminum-based copper-clad plate manufacturing and processing system

Abstract

The invention relates to an aluminum-based copper-clad plate manufacturing and processing system. The system comprises a bottom rack, a vertical rack, a placing plate, a placing mechanism, a cutting mechanism and a pressing and smoothing mechanism. The system can solve the following problems in the manufacturing process of the aluminum-based copper-clad plate: a, in the traditional manufacturing process of the aluminum-based copper-clad plate, the aluminum-based copper-clad plate is formed by extruding a resin plate and a copper foil in the manufacturing process, so that the problem that the side edge of the aluminum-based copper-clad plate is uneven after extrusion forming exists, and in a traditional extrusion forming device, excess materials of an aluminum-based copper-clad plate cannotbe cut off, and subsequent use of the aluminum-based copper-clad plate is affected; b, in the traditional aluminum-based copper-clad plate production and manufacturing process, due to the fact that the aluminum-based copper-clad plate is formed in an extrusion mode, bending of the aluminum-based copper-clad plate is caused by elastic deformation in the extrusion forming process, and the bending problem of the aluminum-based copper-clad plate affects the subsequent processing of the printed circuit board.

Description

technical field [0001] The invention relates to the technical field of aluminum-based copper-clad laminate manufacturing, in particular to an aluminum-based copper-clad laminate manufacturing and processing system. Background technique [0002] Aluminum-based copper clad laminate is a kind of plate-like material that electronic glass fiber cloth or other reinforcing materials are impregnated with resin, single resin, etc. as an insulating adhesive layer, and one or both sides are covered with copper foil and supported by hot pressing. One of the important raw materials in the manufacturing industry. As the substrate material in the manufacture of circuit boards, aluminum-based copper clad laminates mainly play the role of interconnection, insulation and support for printed circuit boards. The quality of aluminum-based copper clad laminates affects circuit signals The transmission speed, energy loss and characteristic impedance are greatly affected, so the quality of the alum...

AI Technical Summary

Problems solved by technology

[0005] The invention provides a manufacturing and processing system for aluminum-based copper-clad laminates, which can solve the following problems in the manufacturing process of aluminum-based copper-clad laminates: a. In the traditional manufacturing process of aluminum-based copper-clad laminates, since aluminum-based copper-clad The plate and copper foil are extruded, so there is a problem of unevenness on the side of the aluminum-based copper-clad laminate after extrusion molding. Traditional extrusion molding equipment cannot remove the remaining material of the aluminum-based copper-clad laminate, which affects the aluminum-based copper-clad laminate. Subsequent use, bIn the traditional aluminum-based copper-clad laminate manufacturing process, because the aluminum-based copper-clad laminate is extruded, the aluminum-based copper-clad laminate is bent due to elastic deformation during the extrusion molding process, and the aluminum-based copper-clad laminate is bent The problem affects the processing of subsequent printed circuit boards

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