Insulation assembly technology in electronic component bonding technology

Abstract

The invention belongs to the technical field of insulation assembly equipment, and particularly discloses an insulation assembly technology in an electronic component bonding technology. The insulation assembly technology comprises the following steps that S1, an electronic component plate is grabbed through a mechanical gripper and placed on a clamp, and the electronic component plate is fixed through the clamp; S2, a specially-made glue solution is used for conducting gluing operation on the place needing to be bonded through a gluing device; S3, the electronic component to be assembled is clamped through an assembling device and is in butt joint with a glued place on the electronic component plate; and S4, the assembled electronic assembly plate is conveyed out through the mechanical gripper. According to the insulation assembly technology in the electronic component bonding technology, the electronic component can be automatically assembled in an insulated manner, a traditional assembly line type assembly manner is changed, the assembly efficiency is improved, and the practicability is high.

Description

Technical field[0001]The invention relates to the related field of insulation assembly equipment, in particular to an insulation assembly process in the bonding process of electronic components.Background technique[0002]In the traditional insulation assembly process of electronic components, most of the electronic components are manually bonded and assembled or mechanical equipment is used to assemble the electronic components one by one. In this assembly method, mechanical equipment is required to repeat the same One action takes more time and assembly efficiency is low. At the same time, because each electronic component is assembled at a different position, it causes a greater burden on the operation of mechanical equipment. Now, an insulation assembly process in the bonding process of electronic components is designed to solve the above problem. problem.Summary of the invention[0003]The purpose of the present invention is to provide an insulating assembly process in the bonding ...

AI Technical Summary

Problems solved by technology

[0002] In the traditional insulation assembly process of electronic components, most of the electronic components are manually bonded and assembled or the electronic components are assembled one by one by mechanical equipment. One action takes a lot of time, and the assembly efficiency is low. At the same time, because the assembly position of each electronic component is different, the operation burden of the mechanical equipment is relatively large. Now, an insulating assembly process in the bonding process of electronic components is designed to solve the above problems. question

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