LED packaging body, key device and LED packaging method

A technology of LED packaging and packaging monomers, which is applied in semiconductor devices, instruments, electrical digital data processing, etc., can solve the problem that the key backlight LED chip packaging structure cannot take into account the thickness and backlight effect, etc., to reduce stray light, reduce Thickness, the effect of protecting the LED chip

Inactive Publication Date: 2020-12-25
BRIGHTEK (SHENZHEN) OPTOELECTRONIC CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the embodiment of the present application is to provide a single LED package to solve the technical problem in the prior art that the key backlight LED chip package structure cannot take into account the thickness and the backlight effect

Method used

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  • LED packaging body, key device and LED packaging method
  • LED packaging body, key device and LED packaging method
  • LED packaging body, key device and LED packaging method

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Embodiment Construction

[0036] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not intended to limit the present application.

[0037] It should be noted that when a component is referred to as being “fixed on” or “disposed on” another component, it may be directly on the other component or indirectly on the other component. When a component is referred to as being "connected to" another component, it can be directly connected to the other component or indirectly connected to the other component.

[0038] It is to be understood that the terms "length", "width", "top", "bottom", "front", "rear", "left", "right", "vertical", "horizontal", "top" , "bottom", "inner", "...

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Abstract

The invention provides an LED packaging body, a key device and an LED packaging method. The LED packaging body comprises an LED chip, a light-transmitting body covering the LED chip and a shading bodycovering the light-transmitting body. The light-transmitting body is formed by integrally forming light-transmitting glue on the LED chip, and the shading body is formed by integrally forming shadingglue on the light-transmitting body. A light outlet hole extending to the light-transmitting body is formed in the face, away from the LED chip, of the shading body, and an electrode of the LED chipis exposed out of the outer side of the LED packaging body. According to the LED packaging body, the key device and the LED packaging method, light emitted by the LED chip can be controlled to be emitted from the light outlet hole after passing through the light-transmitting body, and the light is prevented from being emitted from the side edge of the light-transmitting body, so that stray light is reduced, and the backlight effect of the LED packaging body is improved; and a common support substrate is cancelled in the LED packaging body, so that the thickness of the LED packaging body is reduced, and the thickness of the key device is favorably reduced.

Description

technical field [0001] The present application belongs to the technical field of LED packaging, and more specifically relates to an LED packaging monomer, a button device and an LED packaging method. Background technique [0002] With the development of notebooks and the like, thin and light notebooks are developing towards lighter and thinner directions, and the keys thereof are backlit by LEDs (Light Emitting Diodes, light emitting diodes). One of the existing button backlights adopts a large-angle LED chip packaging structure. The stray light leakage of the large-angle LED chip packaging structure is serious, forming a large aperture when backlighting, and the backlight effect is poor; the other is using a small-angle LED chip packaging structure. However, the small-angle LED chip packaging structure needs to weld the LED chip on the bracket substrate, and fix the light-transmitting glue and opaque glue to the bracket substrate, so as to package the LED chip, which makes ...

Claims

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Application Information

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IPC IPC(8): H01L33/54H01L33/58H01H13/02G06F3/02
CPCH01L33/54H01L33/58H01H13/023G06F3/0202H01L2933/005H01L2933/0058
Inventor何俊杰黄建中
OwnerBRIGHTEK (SHENZHEN) OPTOELECTRONIC CO LTD