Base assembly and semiconductor processing equipment

A processing equipment and semiconductor technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, metal material coating processes, etc., can solve the problem of high temperature of the heating plate, and achieve uniform temperature distribution and good film formation uniformity.

Active Publication Date: 2020-12-29
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Abstract
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Problems solved by technology

[0004] The application discloses a base assembly and semiconductor processing equipment, which can solve the problem that the temperature of the outer edge area of ​​the heating plate is higher than that of the middle area

Method used

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  • Base assembly and semiconductor processing equipment
  • Base assembly and semiconductor processing equipment
  • Base assembly and semiconductor processing equipment

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Embodiment Construction

[0026] In order to make the purpose, technical solution and advantages of the present application clearer, the technical solution of the present application will be clearly and completely described below in conjunction with specific embodiments of the present application and corresponding drawings. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0027] The terms "first", "second" and the like in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific sequence or sequence. It is to be understood that the data so used are interchangeable under appropriate circumstances such that the embodiments of the application can be practiced in sequ...

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Abstract

The invention discloses a base assembly and semiconductor processing equipment. The base assembly is used for bearing and heating a to-be-processed workpiece (100) in the semiconductor processing equipment, the base assembly comprises a bearing part (300) and a cooling module, wherein a first surface of the bearing part (300) bears the to-be-processed workpiece (100), and the cooling module comprises a first cooling mechanism (400) and a second cooling mechanism (500); the first cooling mechanism (400) and the second cooling mechanism (500) are both in heat conduction connection with a secondsurface, deviating from the first surface, of the bearing part (300); and the cooling capacity of the first cooling mechanism (400) and the cooling capacity of the second cooling mechanism (500) are adjustable. The scheme can solve the problem that the temperature of an outer edge area of a heating plate is higher than that of the middle area.

Description

technical field [0001] The present application relates to the technical field of semiconductors, in particular to a base component and semiconductor processing equipment. Background technique [0002] During the PVD (Physical Vapor Deposition, physical vapor deposition) process, the wafer 10 is usually placed on such as figure 1 On the shown heater 20, the heater 20 is provided with a heating plate 21 and a base 22, the outer edge area of ​​the heating plate 21 is connected to the base 22, and there is air between the heating plate 21 and the base 22, and the heating plate 21 is provided with The heating pipe 24 has a cooling water channel 25 inside the base 22, and the heat in the outer edge area of ​​the heating plate 21 can be taken away by the cooling water channel 25 through the base 22. This heat conduction path is relatively long, which causes the cooling water channel 25 to heat the outer edge area of ​​the heating plate 21. The cooling effect is worse than that in ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/54H01L21/67
CPCC23C14/541H01L21/67248
Inventor 田西强
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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