Apparatus and method for clamping and picking up silicon wafers stored in wafer cassettes, and silicon wafer transfer equipment
Patent Information
- Authority / Receiving Office
- CN Β· China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- XIAN ESWIN SILICON WAFER TECH CO LTD
- Publication Date
- 2021-03-05
Smart Images

Figure 1 
Figure 2 
Figure 3
Abstract
Description
technical field
[0001] The invention relates to the technical field of semiconductor production, in particular to a device, method and silicon wafer conveying equipment for clamping and picking silicon wafers stored in a silicon wafer box. Background technique
[0002] Multi-arm wafer transfer equipment for transferring wafers stored in wafer cassettes is known in the prior art, wherein the wafer cassette typically has a plurality of slots arranged in a stacked manner within the wafer cassette Each slot is suitable for placing a single silicon wafer, while the multi-arm silicon wafer transfer device has a plurality of gripping arms, which can simultaneously or at one time grip the slots corresponding to the plurality of gripping arms The corresponding plurality of silicon wafers, and the plurality of gripping arms can move together with the robot arm of the device to transfer the gripped silicon wafers to the target position. A multi-arm wafer transfer machine can maximize ...