Packaged heat dissipation equipment
A heat-dissipating equipment and mounting technology, applied in the field of packaged heat-dissipating equipment, can solve the problem of inconvenient use of heat-dissipating equipment, and achieve the effect of ensuring heat conduction effect, being easy to carry, and enhancing heat-dissipating effect.
Pending Publication Date: 2021-01-08
SHENZHEN TAIWEIXIN MATERIAL TECH CO LTD
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Problems solved by technology
[0005] The purpose of the present invention is to provide a packaged heat dissipation device, aiming to solve the problem that the heat dissipation device is not convenient to use in the prior art
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[0030] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0031] The implementation of the present invention will be described in detail below in conjunction with specific embodiments.
[0032] In the drawings of this embodiment, the same or similar symbols correspond to the same or similar components; The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, or in a specific orien...
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The invention relates to the technical field of heat dissipation equipment, and discloses packaged heat dissipation equipment. The packaged heat dissipation equipment comprises a phase change structure, a semiconductor refrigeration structure and a packaging frame, wherein the semiconductor refrigeration structure is provided with a heat absorption surface and a heat dissipation surface, and whenthe semiconductor refrigeration structure is started, a temperature difference is generated between the heat absorption surface and the heat dissipation surface; the phase change structure and the semiconductor refrigeration structure are packaged on the packaging frame, and the phase change structure and the semiconductor refrigeration structure are arranged in a heat conduction mode; and the phase change structure is provided with an absorption surface. The absorption surface is used for absorbing heat. During use, the phase change structure is used for carrying out primary heat dissipation,then the heat is conducted to the semiconductor refrigeration structure, further heat dissipation is carried out through the semiconductor refrigeration structure, and with the cooperation of the phase change structure and the semiconductor refrigeration structure, the heat dissipation effect is greatly enhanced; and under the action of the packaging frame, the phase change structure and the semiconductor refrigeration structure are packaged into a whole, so that the heat conduction effect between the phase change structure and the semiconductor refrigeration structure is effectively guaranteed, the heat dissipation equipment is convenient to carry, the heat dissipation equipment can be used without assembly, and the use of the heat dissipation equipment is greatly facilitated.
Description
technical field [0001] The patent of the present invention relates to the technical field of heat dissipation equipment, in particular, to packaged heat dissipation equipment. Background technique [0002] With the development of science and technology, the functions of products tend to be diversified in order to meet various needs. As the functions of products are enhanced, the calorific value of products is also gradually increased; It will cause human discomfort, reduce work efficiency, and seriously cause heat stroke and even sudden death; therefore, whether it is based on the needs of human beings or the use of products, the research and development of cooling equipment is more and more important. [0003] At present, the main heat dissipation methods of heat dissipation equipment include air cooling, liquid cooling, heat pipe, compressor refrigeration, etc., to realize heat interaction and reduce temperature. [0004] In the prior art, in order to enhance the heat dis...
Claims
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Login to View More IPC IPC(8): F25B21/02A41D13/005
CPCA41D13/0053F25B21/02
Inventor 蒋涛
Owner SHENZHEN TAIWEIXIN MATERIAL TECH CO LTD