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Light emitting module, manufacturing method of light emitting module and electronic equipment

A manufacturing method and module technology, which is applied in the field of light emitting modules and the production of light emitting modules, and electronic equipment, and can solve the problems of high heat generation, easy aging of dispensing glue due to heat, and reduction of high temperature resistance stability of light emitting modules, etc. problem, to achieve the effect of improving structural stability

Inactive Publication Date: 2021-01-19
NANCHANG OUFEI BIOLOGICAL IDENTIFICATION TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, under this structure, due to the large heat generation of the light emitting module, the dispensing glue is prone to aging due to heat, which reduces the high temperature stability of the light emitting module.

Method used

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  • Light emitting module, manufacturing method of light emitting module and electronic equipment
  • Light emitting module, manufacturing method of light emitting module and electronic equipment
  • Light emitting module, manufacturing method of light emitting module and electronic equipment

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Experimental program
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Embodiment Construction

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention.

[0029] see figure 1 and figure 2 , a light emitting module 100 provided by the present invention, the light emitting module 100 includes a circuit board 10, a light source 20, a bracket 30 and an optical device 40, the circuit board 10 is provided with a light source fixing area 11 and is enclosed in The bracket welding area 12 on the side of the light source fixing area 11, the light source 20 is fixed on the light source fixing area 11, the bottom end of the bracket 30 is plated with a metal layer 50, and the metal layer 50 is welded to the The bracket welding area 12 is used to seal the bracket 30 and the circuit board 10 , and the optical device 40 is fixed on the bracket 30 and is opposite to the light source 20 , so as to transmit the light of the light source 20 ligh...

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PUM

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Abstract

The invention discloses a light emitting module, a manufacturing method of the light emitting module and an electronic device, wherein the light emitting module comprises a circuit board, a light source, a support and an optical device; the circuit board is provided with a light source fixing area and a support welding area surrounding the periphery of the light source fixing area, the light source is fixed in the light source fixing area, the bottom end of the support is plated with a metal layer, the metal layer is welded to the support welding area through welding flux, and therefore the support can be connected with the circuit board in a sealed mode; the optical device is fixed to the support, is opposite to the light source and is used for allowing light of the light source to penetrate through and forming a light beam. The metal layer is welded to the support welding area of the circuit board through the welding flux, the support is stably fixed to the circuit board, the supportand the circuit board are connected in a sealed mode, and therefore the light emitting module is resistant to high temperature, and the structural stability is improved.

Description

technical field [0001] The invention relates to the field of optoelectronic devices, in particular to a light emitting module, a manufacturing method of the light emitting module, and electronic equipment. Background technique [0002] At present, the bracket of the light emitting module is bonded to the circuit board by dispensing glue, and is sealed by dispensing glue. However, under this structure, due to the large heat generation of the light emitting module, the dispensing glue is easily aged due to heat, which reduces the high temperature resistance stability of the light emitting module. Contents of the invention [0003] The object of the present invention is to provide a light emitting module and a manufacturing method of the light emitting module that can increase the stability of high temperature resistance. [0004] In order to solve the above-mentioned technical problems, the present invention provides a light emitting module, wherein the light emitting modul...

Claims

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Application Information

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IPC IPC(8): G06K9/00G01S17/08
CPCG01S17/08G06V40/1318G06V40/166
Inventor 严抗珍陈楠
Owner NANCHANG OUFEI BIOLOGICAL IDENTIFICATION TECH