Packaging structure for multiple chips

Abstract

The invention discloses a multi-chip packaging structure, and the structure comprises a base, an upper cover, ventilation devices, a supporting device, a chip body, connecting wires, pins, a cavity and a pressing plate, wherein the top end of the base is fixedly connected with the upper cover, the ventilation devices are symmetrically arranged at the left end and the right end of the upper cover,and the top end of the base is fixedly connected with the supporting device. The inner side of the supporting device is fixedly connected with the chip main body, and the front end and the rear end ofthe chip main body are respectively provided with a connecting wire. The beneficial effects are that the supporting device is arranged at the top end of the base, so that the beneficial effect of conveniently discharging heat by additionally arranging a separation type heat absorption part is achieved; the ventilation devices are arranged at the left end and the right end of the upper cover respectively, moisture absorption is carried out through the drying agent layer fixed to the inner wall of the through opening, dust isolation is carried out through the ventilation cloth layer, and the beneficial effect that a blocking part is additionally arranged to improve chip protection is achieved.

Description

technical field [0001] The invention belongs to the technical field of chip packaging, in particular to a packaging structure for multiple chips. Background technique [0002] Chip packaging, the shell used to install semiconductor integrated circuit chips, plays the role of placing, fixing, sealing, protecting the chip and enhancing the electrothermal performance, and is also a bridge to communicate the internal world of the chip with the external circuit - the contacts on the chip are connected to the On the pins of the package shell, these pins are connected to other devices through the wires on the printed board; [0003] With the rapid development of the semiconductor industry, in order to meet the needs of users and improve the performance of electronic products, electronic products are becoming thinner and miniaturized. At present, the packaging of semiconductor chip stacked products mostly adopts multiple chip stacking technology. Stack two or more chips sequentiall...

AI Technical Summary

Problems solved by technology

[0006] In order to overcome the shortcomings of the existing technology, a packaging structure for multi-chip is proposed to solve the problem that the heat generated by the stacking of chips in the packaging structure is not easy to discharge, and the protection of the chip at the heat discharge point is insufficient. The beneficial effect of setting separated heat-absorbing parts to facilitate heat discharge, and adding barrier parts to improve the beneficial effect of chip protection

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