Double-sided heat dissipation power module and packaging method thereof

Abstract

The invention discloses a double-sided heat dissipation power module and a packaging method thereof. The module comprises a power chip, an upper lining plate, a lower lining plate and a cushion blockassembly, wherein one side of the power chip is connected with the lower lining plate through a first connecting layer, and the other side of the power chip is connected with one end of the cushion block assembly through a second connecting layer; the other end of the cushion block assembly is connected with the upper lining plate through a third connecting layer, the cushion block assembly comprises a first cushion block and a second cushion block, one end of the first cushion block is connected with a power chip through a second connecting layer, and the other end of the first cushion blockis detachably connected with one end of the second cushion block; and the other end of the second cushion block is connected with the upper lining plate through a third connecting layer. The inventionhas the advantages of reducing the process difficulty, being convenient to connect, ensuring the heat-conducting capability, reducing the cost and the like.

Description

technical field [0001] The invention mainly relates to the technical field of power semiconductor devices, in particular to a double-sided heat dissipation power module and a packaging method thereof. Background technique [0002] The general double-sided heat dissipation power module uses an integrally formed copper block as a pad to complete the heat conduction and conduction functions, such as figure 1 shown. Double-sided heat dissipation power modules generally require three connection processes. The first time is to connect the power chip 3 to the lower substrate 1 through the first connection layer 2; the second time is to connect one end of the spacer 10 through the second connection layer 4 connected to the power chip 3, such as figure 2 Shown; The third time is that the upper liner 8 is connected to the other end of the spacer 10 through the third connecting layer 7, as image 3 shown. In this technological process, there are following problems: [0003] 1. Be...

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Problems solved by technology

[0003] 1. Because the current process requires simultaneous heating and connection from both sides of the upper lining and the lower lining, when the upper lining 8 is connected to the pad 10, the heating of the lower lining 1 needs to pass through the power chip 3 and the pad 10 There are many conductive parts, which leads to insufficient connection temperature, which makes it difficult to realize the third connection process, and it is prone to low connection quality.

[0004] 2. Due to the need for three high-temperature processes, the warpage of each liner is greatly increased, and the risk of glue overflow during the mold transfer process is increased

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