High-temperature-resistant grounding elastic piece and electronic equipment

A technology of high temperature resistance and elastic parts, applied in the direction of circuit, connection, fixed connection, etc., can solve the problem of conflicting integration of electronic components and high temperature resistant grounding elastic parts, so as to overcome easy cracking, ensure normal integration, and overcome mutual integration. contradictory effect

Active Publication Date: 2021-02-02
SHENZHEN JOHAN MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the embodiments of the present invention is to provide a high-temperature-resistant grounding elastic part and electronic equipment to solve the technical problem of conflicting integration of electronic components and high-temperature-resistant grounding elastic parts when the integration space is insufficient

Method used

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  • High-temperature-resistant grounding elastic piece and electronic equipment
  • High-temperature-resistant grounding elastic piece and electronic equipment
  • High-temperature-resistant grounding elastic piece and electronic equipment

Examples

Experimental program
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Effect test

Embodiment 1

[0037] Such as figure 1 As shown, a high-temperature-resistant grounding elastic member includes: a conductive substrate 1 and a high-temperature-resistant elastic body 2 .

[0038] Preferably, the conductive substrate 1 is provided with a conductive part 11 and a covering part 12 . The covering part 12 is bent to form a cavity 121 for wrapping the high temperature resistant elastic body 2, the conductive part 11 is fixed to the covering part 12, and the conductive part 11 extends to the outside of the covering part 12, and extends to the Originally integrate the position of the high-temperature-resistant grounding elastic piece and form a corresponding electrical connection to ensure the normal use of the high-temperature-resistant grounding elastic piece. The length of the conductive part 11 is selected according to actual needs so that the high-temperature-resistant grounding elastic piece can be installed on the other locations.

[0039] Preferably, the cladding portion ...

Embodiment 2

[0047] Such as figure 2 As shown, the difference between the second embodiment and the first embodiment is that the first connection section 122 , the second connection section 123 , the third connection section 124 , the fourth connection section 125 , and the conductive part 11 are sequentially connected as an integral structure. The connection between the first connecting section 122 and the conductive part 11 is fixed by glue. In actual use, the conductive part 11 is fixed with the integrated circuit board or the metal shell by welding, and the bottom of the conductive part 11 is provided with an adhesive layer for pasting and positioning. During welding, the adhesive layer will be broken down and will not affect the grounding elasticity. Compared with the traditional compression connection, the welding connection is more reliable.

Embodiment 3

[0049] Such as image 3As shown, the difference between the third embodiment and the first embodiment is that the PI film layer 14 is provided with a fourth connecting section 125 and a fixing section 126 . The copper foil layer 15 of the covering part 12 is provided with a first connection section 122, a second connection section 123, and a third connection section 124, and the conductive part 11 is connected with the first connection section 122, the second connection section 123, and the third connection section 124. In an integrated structure, the conductive part 11 and the bottom of the first connecting section 122 are provided with an adhesive layer, and the fixed section 126 and the conductive part 11 are fixed by glue. In actual use, the conductive part 11 is fixed with the integrated circuit board or the metal shell by welding, and the bottom of the conductive part 11 is provided with an adhesive layer for pasting and positioning. During welding, the adhesive layer wi...

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Abstract

The invention relates to a high-temperature-resistant grounding elastic piece and electronic equipment. The high-temperature-resistant grounding elastic piece comprises a conductive base material anda high-temperature-resistant elastic body. According to the high-temperature-resistant grounding elastic piece, the high-temperature-resistant elastic body is wrapped with the conductive base material, the conductive base material is provided with the conductive part extending outwards, and a distance between the high-temperature-resistant grounding elastic piece and an original integrated position is increased through the conductive part; and functions of the high-temperature-resistant grounding elastic piece are not influenced and integration of electronic components is not influenced either. Therefore, the high-temperature-resistant grounding elastic piece provided by the invention adopts a technical means of extending the connection distance, overcomes the technical problem that the integration of the electronic component and the high-temperature-resistant grounding elastic piece contradicts with each other when the integration space is not enough, and achieves the technical effectof integrating the high-temperature-resistant grounding elastic piece without influencing the integration of the electronic component.

Description

technical field [0001] The invention relates to the field of conductive components, in particular to a high-temperature-resistant grounding elastic part and electronic equipment. Background technique [0002] With the continuous development of integrated electronic technology, more and more electronic components are integrated in various electronic communication equipment, and the electronic components will interfere with each other during use. At present, electronic communication equipment basically uses high-temperature-resistant grounding elastic parts to guide away electromagnetic waves or static electricity generated by electronic components. However, for electronic communication equipment that needs to integrate more electronic components, there is a problem of insufficient integration space, making electronic The integration of components and high temperature ground springs is contradictory. Contents of the invention [0003] The technical problem to be solved by t...

Claims

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Application Information

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IPC IPC(8): H01R4/64H01R4/48H01R12/51
CPCH01R4/64H01R4/48H01R12/51
Inventor 陈方刘晶云
Owner SHENZHEN JOHAN MATERIAL TECH CO LTD
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