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Wrapped heat-conducting grounding elastic piece and electronic device

A technology of electronic equipment and elastic parts, which is applied to grounding circuits, modification through conduction and heat transfer, and electrical components. It can solve the problems of easy bending and cracking of metal coatings, improve surface thermal conductivity, reduce production costs, and overcome problems easily. The effect of bending and cracking

Inactive Publication Date: 2021-02-09
SHENZHEN JOHAN MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the embodiments of the present invention is to provide a wrapped heat-conducting grounding elastic member and electronic equipment to solve the technical problem that the metal plating layer of the elastic member is thin and easy to bend and crack

Method used

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  • Wrapped heat-conducting grounding elastic piece and electronic device
  • Wrapped heat-conducting grounding elastic piece and electronic device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Such as figure 1 As shown, a wrap-type thermally conductive grounding elastic member includes: a shielding film 1, a high temperature resistant elastic body 2, and the shielding film 1 is provided with a cavity for wrapping the elastic body 2 (not shown in the figure).

[0034] Preferably, the shielding film 1 includes a supporting film layer 11 and a copper foil layer 12 from inside to outside, and the outer surface of the copper foil layer 12 is provided with a transition metal layer and a conductive metal layer in sequence from inside to outside.

[0035] Preferably, the supporting film layer 11 includes a PI film layer 111 , a first adhesive layer 112 , and a PET film layer 113 from outside to inside. The PI film layer 111 and the copper foil layer 12 are coated on the surface of the copper foil layer 12 by adhesive bonding, melting and solidification, or liquid PI for curing and compounding. The combination of the copper foil layer 12 and the PI film layer 111 imp...

Embodiment 2

[0045] Such as figure 2 As shown, the difference from Embodiment 1 is that Embodiment 2 is a half structure of Embodiment 1, and the structure of Embodiment 1 can be produced during production, and then cut from the middle.

[0046] The present invention also discloses an electronic device adopting the above-mentioned wrap-type thermally conductive grounding elastic member. The electronic device also includes a circuit board or a metal shell for electrically connecting the wrapped-type heat-conductive grounding elastic member. The circuit board or metal shell is bonded and fixed.

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Abstract

The invention relates to a wrapped heat-conducting grounding elastic piece and an electronic device, and belongs to the field of conductive components. The wrapped heat-conducting grounding elastic piece comprises a shielding film and a high temperature resistant elastic body, the shielding film is provided with a cavity used for wrapping the elastic body and comprises a supporting film layer anda copper foil layer from inside to outside, and a transition metal layer and a conductive metal layer are sequentially arranged on the outer surface of the copper foil layer from inside to outside. Therefore, according to the wrapped heat conduction grounding elastic piece, by adopting the technical means of improving the strength of the shielding film via the supporting film layer and electroplating the metal layer on the surface of the copper foil layer, the technical problem that a metal coating electroplated on the elastic piece is thinner and is prone to bending and cracking is solved, and the technical effects that a thicker metal plating layer is easy to electroplate, and the metal plating layer cannot be bent or cracked are achieved.

Description

technical field [0001] The invention relates to the field of conductive components, in particular to a wrapped heat-conducting ground elastic part and electronic equipment. Background technique [0002] With the continuous development of integrated electronic technology, more and more electronic components are integrated in various electronic communication equipment, and the electronic components will interfere with each other during use. At present, electronic communication equipment basically adopts grounding elastic parts to guide away electromagnetic waves or static electricity generated by electronic components. The grounding elastic part is mainly composed of a grounding film and an internal elastic body. In the 5G era, due to the more complex high-frequency signals and higher grounding requirements, the traditional conductive cloth can no longer meet the needs of the grounding film, and the base material of the grounding film gradually transitions to conductive Good ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K9/00H05K7/20H01R4/64
CPCH05K9/0088H05K9/0064H05K7/2039H01R4/64
Inventor 陈方刘晶云
Owner SHENZHEN JOHAN MATERIAL TECH CO LTD
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