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A lead frame leveling, alignment and feeding device

A lead frame and leveling technology, which is used in transportation and packaging, semiconductor/solid-state device components, semiconductor devices, etc., can solve the problem of copper sheets that cannot be well adapted to different widths, and copper sheets lack conveying and leveling. methods, etc., to achieve the effect of strong practicability, stable structure and simplified mechanism

Active Publication Date: 2021-03-23
四川富美达微电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, for the slit copper coils, there is no effective conveying and calibrating flow-through operation method for the conveying of copper sheets, and the conveying guide cannot be well adapted to the situation of copper sheets of different widths, so it is necessary to improve

Method used

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  • A lead frame leveling, alignment and feeding device
  • A lead frame leveling, alignment and feeding device
  • A lead frame leveling, alignment and feeding device

Examples

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Embodiment

[0030] Such as Figure 1~Figure 6 As shown, a lead frame leveling, alignment and feeding device provided in this example includes: a plurality of conveying mechanisms 1 arranged at uniform intervals, and supporting mechanisms 2 arranged between adjacent conveying mechanisms 1 .

[0031] The conveying mechanism 1 includes a pair of lower rollers 11 and upper rollers 12 arranged at intervals, and the rotation directions of the lower rollers 11 and the upper rollers 12 are opposite. Two adjacent conveying mechanisms 1 transmit power between the two lower rollers 11 through the lower crawler belt 111, the rotation shaft of one of the lower rollers 11 is connected to the lower roller motor 112, and the power is transmitted between the two upper rollers 12 through the upper crawler belt 121. The rotation shaft of one of the upper rollers 12 is connected with an upper roller motor 122, and the lower roller motor 112 and the upper roller motor 122 rotate in opposite directions. The l...

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PUM

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Abstract

A lead frame leveling, aligning and feeding device, comprising: a plurality of conveying mechanisms arranged evenly at intervals, and a support mechanism arranged between adjacent conveying mechanisms; the conveying mechanism includes a pair of lower rollers and upper rollers arranged at intervals; The support mechanism includes a fixed support platform and a mobile support platform. The bottom surface of the mobile support platform is provided with a moving rod and a guide rod. The fixed support platform is provided with a pair of guide channels. Adjusting gear, the adjusting gear is connected with the output shaft of an adjusting motor, one side of the moving rod is provided with a tooth portion, the moving rods of the moving support platforms on both sides are respectively meshed on both sides of the tooth portion through the tooth portion, and the fixed support table is provided with a guide limit block , the mobile support platform is provided with at least one guide roller. The slit copper foil rolls are conveyed with copper sheets to achieve assembly line alignment and leveling. After leveling, the material is fed to the stamping die. Adaptive adjustment can be made according to the width and thickness of the copper sheets, which is highly practical.

Description

technical field [0001] The invention relates to the field of semiconductor components, in particular to a lead frame, in particular to a lead frame leveling, alignment and feeding device. Background technique [0002] Lead frame is an important carrier of semiconductor devices and integrated circuit modules. In the preparation of this type of device / module, the required wafer / chip is usually fixed on the designated area of ​​the lead frame by means of bonding, etc., and electrical conduction is achieved by bonding gold wires or setting jumpers, and then packaged. Plastic base, and corresponding cutting, punching, folding, etc. to obtain products. [0003] In the preparation of the lead frame, it is necessary to use a mold to perform stamping or pressing of different shapes on the designated areas of the lead frame, so as to obtain the finished lead frame. The raw material used to prepare the lead frame is a copper coil. The copper coil is used as a raw material after being...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/677H01L23/495H01L21/48
CPCH01L21/4821H01L21/4839H01L21/67706H01L23/495
Inventor 曾尚文陈久元杨利明刘高宸
Owner 四川富美达微电子有限公司