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A ddr sending circuit

A technology for sending circuits and circuits, applied in the direction of logic circuits, logic circuit interface devices, logic circuit connection/interface layout, etc., can solve problems such as difficulty in further improving work speed, and achieve the effect of ensuring safety and improving work speed

Active Publication Date: 2021-06-11
BRITE SEMICON SHANGHAI CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, limited by the voltage regulations in the electrical specification, the existing DDR4 and other interface transmission circuits usually still use slower high-voltage devices as the main drive circuit and front drive circuit, and it is difficult to further increase the working speed

Method used

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Embodiment Construction

[0040] The present invention will be further described below in conjunction with accompanying drawing.

[0041] see Figure 1-3 , the DDR sending circuit of the present invention includes: a first PMOS transistor PM1, a second PMOS transistor PM2, a first NMOS transistor NM1, a second NMOS transistor NM2, a resistor R1, a non-inverter 100, an inverter 200, and a first The low voltage device 300 has a voltage between a voltage signal VDDL and a third voltage signal VDDQ.

[0042] The source of the first PMOS transistor PM1 is connected to the third voltage signal VDDQ, the gate is connected to the output terminal of the low voltage device 300 , and the drain is connected to the source of the second PMOS transistor PM2. The three input terminals of the low voltage device 300 are respectively connected to the output terminal of the invertor 100 , the first voltage signal VDDL and the third voltage signal VDDQ. The input terminal of the non-inverter 100 is connected to the level...

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PUM

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Abstract

The invention discloses a DDR sending circuit, comprising: a first PMOS transistor, a second PMOS transistor, a first NMOS transistor, a second NMOS transistor, a resistor, a non-inverter, an inverter and a circuit for providing a first voltage signal to the second A low-voltage device with a voltage between the three voltage signals, the source of the first PMOS transistor is connected to the third voltage signal, the gate is connected to the output end of the low-voltage device, and the drain is connected to the source of the second PMOS transistor; The three input terminals of the low-voltage device are respectively connected to the output terminal of the non-phase device, the first voltage signal and the third voltage signal; the input terminal of the non-phase device is connected to a level signal; the first NMOS transistor The source of the inverter is grounded, the gate is connected to the output terminal of the inverter, and the drain is connected to the source of the second NMOS transistor; the input terminal of the inverter is connected to the level signal; the drain of the second PMOS transistor and the second NMOS transistor The drains of the two NMOS transistors are connected to each other and connected to the first end of the resistor. The high-speed low-voltage device is used as the main drive circuit and the front drive circuit to effectively improve the working speed.

Description

technical field [0001] The invention relates to a DDR (Double Rate Synchronous Dynamic Random Access Memory) sending circuit. Background technique [0002] At present, limited by the voltage regulations in the electrical specification, the existing DDR4 and other interface transmission circuits usually still use slower high-voltage devices as the main drive circuit and front drive circuit, and it is difficult to further increase the working speed. The DDR output interface drive circuit usually uses a cmos (complementary metal oxide semiconductor) tube as the output drive resistor, or a combination of a cmos tube and a resistor to form an output drive resistor, which is limited by electrical specifications, such as the DDR4 power supply voltage is specified as 1.2v , so the main drive unit and the front drive circuit must use a high-voltage cmos tube (IO device) that can withstand more than 1.2v. With the improvement of the process, the speed of the low-voltage core device (c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H03K19/017H03K19/0175H03K19/0185
CPCH03K19/017H03K19/01728H03K19/01742H03K19/017509H03K19/01855
Inventor 孔亮陈捷刘亚东庄志青
Owner BRITE SEMICON SHANGHAI CORP
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