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Wafer processing method

A processing method and wafer technology, applied to metal processing equipment, film/sheet adhesives, manufacturing tools, etc., can solve problems such as pollution sources, reduced adhesion between chuck table and protective tape, and insufficient cleaning , to achieve the effect of solving pollution sources

Pending Publication Date: 2021-02-26
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In particular, when a protective tape is pasted on the front surface of the wafer via a paste or the like, undulations are formed on the front side of the wafer, and the undulations reduce the adhesion between the chuck table and the protective tape, which may cause grinding debris to enter. The main cause of the gap between the chuck table and the protective belt
In addition, although the grinding surface has been cleaned by the cleaning unit provided in the grinding device for the wafer thus completed, the cleaning of the protective tape side of the wafer held by the chuck table is not sufficient. Therefore, there is a problem of becoming a source of pollution when transferring to the next process

Method used

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Embodiment Construction

[0024] Hereinafter, a wafer processing method according to an embodiment of the present invention will be described in detail with reference to the drawings.

[0025] The wafer processing method of this embodiment includes the following steps: an adhesive tape sticking step, where the adhesive tape is pasted on the front surface of the wafer; Thermocompression bonding sheet; integration process, heating the thermocompression bonding sheet and pressing it with a flat member, and crimping the thermocompression bonding sheet to the adhesive tape for integration; grinding process, holding the thermocompression bonding sheet side Grinding the wafer to a desired thickness while supplying grinding water to the back surface of the wafer on the chuck table of the grinding device; Peel the thermocompression bonding sheet from the adhesive tape. Hereinafter, each step will be described in order.

[0026] (Adhesive tape sticking process)

[0027] exist figure 1 A perspective view illu...

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Abstract

Provided is a wafer processing method capable of sufficiently removing abrasive dust adhering to a wafer held by a chuck table during abrasive processing. The wafer processing method includes: an adhesive tape attaching step of attaching an adhesive tape to a front surface of a wafer; a thermocompression bonding sheet arrangement step of arranging a thermocompression bonding sheet on the adhesivetape adhered to the front surface of the wafer; an integration step for heating the thermocompression bonding sheet, pressing the thermocompression bonding sheet with a flat member, and crimping the thermocompression bonding sheet to the adhesive tape to integrate the thermocompression bonding sheet and the adhesive tape; a grinding step in which the thermocompression bonding sheet side is held ona chuck table of a grinding device, and the wafer is ground to a desired thickness while grinding water is supplied to the back surface of the wafer; and a peeling step for removing the integrated wafer from the chuck table and peeling the thermocompression bonding sheet from the bonding tape.

Description

technical field [0001] The present invention relates to a wafer processing method, which grinds the back surface of a wafer divided by a plurality of intersecting dividing lines and formed with a plurality of devices on the front surface. Background technique [0002] After the wafer is divided by a plurality of intersecting dividing lines and formed with multiple devices such as IC and LSI on the front surface, the protective tape is pasted on the front surface to protect it, and the adhesive tape side is held by the chuck of the grinding device. On the stage, the back surface is ground to a desired thickness (for example, refer to Patent Document 1). [0003] A wafer formed to a desired thickness as described above is divided into individual device chips by a dicing device or a laser processing device, and the divided device chips are used in electronic devices such as mobile phones and personal computers. [0004] The grinding apparatus is roughly composed of the followi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683H01L21/304
CPCH01L21/6835H01L21/304H01L2221/68327H01L2221/68386B24B7/228H01L21/6836H01L2221/6834H01L21/30625C09J7/241C09J7/255H01L2221/68318H01L2221/68381
Inventor 辻本浩平
Owner DISCO CORP
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